台积电先进封装厂信息曝光！

21ic电子网01-11

台积电先进封装争夺战：苹果英伟达产能博弈升级1 月 8 日，科技媒体消息显示，苹果与英伟达在台积电先进封装产能上的 “互不侵犯” 格局将被打破。此前二者技术路线泾渭分明，苹果依托 InFO 封装生产 A 系列芯片，英伟达则以 CoWoS 技术打造 GPU。点击看：重磅！全球封测一哥！日月光涨价20%！随着芯片设计复杂度提升，苹果为突破性能瓶颈，计划为 A20 芯片搭载 WMCM 封装技术，为高端 ...

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