CES 2026看点回顾：前沿技术百花齐放，科技创新加速走向应用落地

中关村在线01-09

【ZOL中关村在线原创新闻】随着CES 2026在拉斯维加斯正式落下帷幕，这场年度科技盛会再次集中展示了全球消费电子领域的最新动向。在为期三天的展期内，各家厂商呈现的前沿技术与创新成果，成为了外界观察行业走向、梳理产业脉络的关键窗口。那么在云集的海量品牌与产品之中，哪些内容更值得深入探讨？这里我们精选出几款具有代表性的产品和技术方向，希望能帮助大家更高效地把握本届CES的核心看点。1终端形态持续...

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implementation","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDX":0.6,"INTC":0.74,"NVIW.SI":0.6,"NVD3.UK":0.6,"LNVGY":1.87,"AMD":1.9,"QCOM":1.88,"NVDY":0.6,"01070":0.9,"NVDA":1.92,"NVD":0.6,"NVDS.UK":0.6,"NVDS":0.6,"NVD2.UK":0.6,"SNVD.UK":0.6,"00992":1.87,"NVDL":0.6,"3NVD.UK":0.6,"2NVD.UK":0.6,"00175":0.9,"NVDU":0.6,"NVDD":0.6},"content_text":"【ZOL中关村在线原创新闻】随着CES 2026在拉斯维加斯正式落下帷幕，这场年度科技盛会再次集中展示了全球消费电子领域的最新动向。在为期三天的展期内，各家厂商呈现的前沿技术与创新成果，成为了外界观察行业走向、梳理产业脉络的关键窗口。那么在云集的海量品牌与产品之中，哪些内容更值得深入探讨？这里我们精选出几款具有代表性的产品和技术方向，希望能帮助大家更高效地把握本届CES的核心看点。1终端形态持续进化，体验诉求驱动技术创新在本次大会上，手机与显示相关技术依旧是重要看点之一。展会期间，三星公开展示了一款被称为“无折痕”的折叠屏OLED面板。从现场对比效果来看，该面板在完全展开后，中轴折痕已经非常不明显，相比传统折叠屏在观感完整性上有明显改善。右侧为三星“无折痕屏幕”根据介绍，这块OLED面板来自三星于去年8月推出的新品牌MONT FLEX，产品名中的“M”代表机械耐用性，“O”代表光机平面，“N”代表窄边框，“T”代表轻薄设计。三星显示执行副总裁兼移动显示营销团队负责人尹在南曾表示：“继推出采用新开发的‘抗冲击结构’的可折叠面板并通过了50万次耐久性测试之后，我们将继续突破界限，推出更加精致的可折叠产品，超越市场预期”。 根据曝光消息，未来三星折叠屏Galaxy Fold系列或将用上这块OLED面板。在产品方面，联想在CES 2026期间正式发布moto首款大折叠机型Razr Fold，同时还带来了moto razr 60 2026世界杯限量版等新品。moto Razr Fold采用8.09英寸2K内屏，搭配6.56英寸外屏，后置5000万像素索尼LYTIA主摄、5000万像素超广角以及5000万像素3X潜望长焦三摄，前置2000万像素镜头，并支持moto Pen Ultra手写笔。Razr Fold的发布，也补齐了moto在大折叠形态上的产品布局。不过，moto并未透露这款新机的核心配置和具体价格，官方表示Razr Fold将于今夏在美国上市发售，届时将公布最终定价。TCL同样带来了两款搭载NXTPaper技术的新品：NXTPaper 70 Pro智能手机与Note A1平板电脑。其中，NXTPaper 70 Pro配备 6.9 英寸NXTPaper 4.0屏幕，表面呈现类电子墨水屏的磨砂质感，可有效降低反光与视觉疲劳，并内置“Max Ink模式”，通过简化界面与减少通知干扰，提升阅读与书写时的专注度。硬件方面，该机搭载天玑7300处理器、8GB内存，配备支持OIS的5000万像素主摄，并具备IP68防尘防水能力，欧洲市场售价为339欧元。同期亮相的Note A1平板则更明确聚焦数字笔记场景。其采用11.5英寸NXTPaper显示屏，运行基于Android的轻量化系统，仅预装浏览器、邮件等基础应用，不开放Google Play商店，以减少使用干扰。配合T-Pen Pro手写笔，支持“圈选保存”至“灵感空间”，并通过触觉反馈模拟真实书写摩擦感。该产品将于今年2月底发货，定价549美元，目前在Kickstarter平台以419美元早鸟价接受预订。ROTBOT PHONE（@图源见水印）值得关注的是，荣耀在CES期间带来了一款颇具未来感的新品——ROBOT PHONE。这是全球首款机器人形态智能手机，其背部集成的隐藏式三轴机械臂云台。用户只需轻点屏幕，云台即可自动展开，实现灵活转动、智能跟拍与专业级防抖。此外，ROBOT PHONE还搭载了荣耀自研的端侧大模型YOYO，具备情感感知与主动服务能力，系统可通过多模态传感器识别用户情绪、使用习惯及环境状态，主动推送内容、调整设备参数，甚至联动全场景生态设备。荣耀方面确认，该产品计划于2026年上半年正式量产。2智能出行深度演进，中国智驾闪耀CES现场在CES 2026上，汽车相关话题依旧保持着较高的热度，越来越多整车厂与产业链企业选择在这一舞台发布新技术、新产品，CES的“含车量”正逐年提升。在今年展会期间，吉利汽车正式发布千里浩瀚G-ASD智能辅助驾驶解决方案（Geely Afari Smart Driving），该方案由吉利与千里智驾联合研发，其中，“G”代表吉利，“ASD”代表千里智驾。G-ASD是双方联合研发的高含模量智能辅助驾驶解决方案，将全面覆盖从L2到L4级别的智驾能力。技术架构方面，千里浩瀚G-ASD采用Smart AI Agent架构，并引入WAM世界行为模型，在阶跃星辰通用AI大模型支持下，云端多模态模型与世界模型参数规模达到千亿级。千里浩瀚G-ASD在行车、安全、泊车等方面的能力，都有明显的进化。以泊车为例，D2D车位到车位领航辅助功能彻底打通行车与泊车全场景壁垒，用户一次激活即可实现从起点车位到终点车位、P挡到P挡的全程无缝衔接。针对跨楼层地库穿行、闸机自动识别、环岛通行等复杂路况，系统依托全域AI 2.0技术体系支撑，可实现无感丝滑的智驾体验，大幅降低用户驾驶操作强度。安全防护方面，千里浩瀚G-ASD通过六大主动安全升级构建全场景防护矩阵，其中G-AES通用障碍物自动紧急避让功能可识别三角牌、落石等异形障碍物，甚至具备连环事故场景下连续两次紧急避让的能力；配合SOS靠边停车辅助、360度全向主动安全防御、前车溜车提醒等细分功能，实现行车与泊车全流程的安全守护。3芯片巨头齐秀“肌肉”，多款新平台引关注在CES 2026上，多家芯片厂商集中发布新平台、新技术，覆盖游戏、PC与AI相关应用场景，成为全球科技界与资本市场关注的焦点。NVIDIA宣布推出DLSS 4.5技术，引入了动态多帧生成功能和全新的6倍多帧生成模式。DLSS 4.5可为每个传统渲染帧额外生成多达5帧，动态提升性能，让GeForce RTX 50系列GPU在游戏开启路径追踪选项时实现240+ FPS的游戏体验，带来迄今为止最流畅的游戏表现。DLSS 4.5将采用全新的第二代Transformer模型，该模型基于NVIDIA多年的技术积累研发，依托五倍于初代Transformer模型的计算资源，通过大规模高保真数据演算，使具备更强的场景理解能力与像素采样智能度，实现了画质与性能双重突破。目前，该功能已适配超过400款游戏与应用，用户需在NVIDIAApp的“设置”——“关于”中选择加入测试版，或等待1月13日发布的正式版。AMD则带来了新一代锐龙9000X3D处理器：锐龙7 9850X3D。这款处理器采用Zen5架构，支持第二代3D Vcache技术，与竞品相比在超过35款的游戏中，平均性能提升高达27%，为游戏玩家带来全新千帧体验。从规格来看，其加速频率较前代提升400MHz，达到5.6GHz的新高，并且延续了AMD锐龙7 9800X3D的8核心16线程的参数配置，CPU主频保持4.7GHz，因为3DV技术L3缓存依旧达96MB，总缓存容量104MB，并集成2个RDNA 2计算单元的核显。除锐龙7 9850X3D，AMD还推出了锐龙AI 400系列处理器，首发包含七款新品：Ryzen AI 9 HX 475、Ryzen AI 9 HX 470、Ryzen AI 9 465、Ryzen AI 7 450、Ryzen AI 7 445、Ryzen AI 5 435以及Ryzen AI 5 430，覆盖4核8线程到12核24线程设计，最高加速频率5.2GHz，L2+L3缓存最高达到36MB，支持的内存速度提升到了8000 MT/s和8533 MT/s，NPU算力最高达到60TOPS，集显执行单元数量最高达到了16个。搭载Ryzen AI 400系列的笔记本电脑和紧凑型台式机系统预计将于2026年一季度上市。官方目前已确认Acer、华硕（ASUS）、惠普（HP）和联想等主要合作伙伴将推出相关产品。英特尔方面，同样发布自家首个Intel 18A制程工艺处理器——Panther Lake，也就是英特尔第三代酷睿Ultra平台。得益于RibbonFET全环绕栅极晶体管技术和PowerVia背面供电技术的突破，Panther Lake在晶体管密度、性能、能效等方面取得了极大进步，可以为基于其打造的新一代PC产品带来极其出色的性能、散热、续航表现。在本次发布会上，英特尔Panther Lake家族一举推出多达14款不同规格的SKU，最高型号为英特尔酷睿Ultra X9 388H和酷睿Ultra 9 386H，16核心16线程的CPU带来更强的计算能力，50 TOPS算力的NPU计算单元继续以低功耗赋能AI应用，而大放异彩的Xe3架构锐炫B390核显凭借12个Xe核心带来的强劲图形性能与120TOPS的AI算力升级，轻松覆盖游戏、创作到AI应用到全场景应用需求。在CES展前，高通发布了骁龙X2 Plus平台，这也是高通面向PC领域推出的新款处理器。骁龙X2 Plus力求为用户带来更加出色的AI加速能力、更强的图形性能以及更加优秀的能效比。而且高通强调了骁龙X2 Plus在价格方面的竞争力，这对于未来高通骁龙平台PC产品整体竞争力的提升奠定基础。从硬件规格方面来看，骁龙X2 Plus主要包含了十核心的X2P-64-100以及六核心的X2P-42-100，二者均采用高通第三代Oryon架构设计，台积电N3P 3nm工艺制程打造。前者集成了6个Prime性能核和4个Performance能效核，后者的六个核心全部为Prime性能核。相比上一代骁龙X Plus来说，单核性能提升35%，功耗降低43%，单核频率最高达到4.04GHz，全核加速频率最高也突破了4GHz。骁龙X2 Plus系列在NPU方面做了巨大升级，全新的Hexagon NPU峰值AI算力达到80TOPS，较前代提升78%，是目前AI算力最强的NPU计算单元。因此可以流畅支持130B参数本地大模型推理。GPU部分则是集成了Adreno X2-85/X2-90 GPU，支持硬件加速光线追踪和可变速率着色。在功耗方面，骁龙X2 Plus默认为12W至32W，因此可以支持无风扇设计，而且支持笔记本、Mini PC等众多形态的设备。另外骁龙X2 Plus内存规格为LPDDR5x-9523，最高容量可支持128GB，满足当前的AI应用需求。此外，骁龙X2 Plus提供Wi-Fi 7无线网络，并且可选5G蜂窝连接。据悉，搭载高通骁龙X2 Plus平台的笔记本电脑新品将在2026年上半年正式发售，目前联想、惠普、华硕等主要OEM厂商都会在CES期间发布相关新品。中关村在线观点：整体来看，CES 2026依然延续了“技术先行、应用跟进”的基调。无论是智能手机在体验与形态上的持续探索，智能汽车在辅助驾驶领域的进阶，还是芯片厂商围绕 AI 算力、能效与平台化能力展开的正面竞争，本质上都是在不同维度上通过技术创新来响应日益多元的用户需求。这种多赛道并进的局面，反映了产业链上下游在技术储备与市场应用之间正达成一种新的平衡，在提升产品竞争门槛的同时，也为整个行业的长远增长注入了持续动力。可以说，CES 2026集中展示了当下的前沿技术成果，也对未来一段时间内的产业走向给出了重要预示。在行业各方的共同推动下，全球科技产业正展现出更具广度与深度的发展潜力，而这些变化也将持续对人们的数字化生活产生深远影响。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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