全球硅光代工格局——巨头主导，生态初现

势银芯链01-09

全球硅光市场达到14亿美元，CPO光模块是硅光的主要应用场景。目前硅光制程的工艺节点主要集中在180nm-90nm，也就是说在8英寸晶圆上制作，部分国际头部代工厂已经实现45nm节点的硅光工艺（如台积电、格芯、Tower等）。台积电通过深度绑定模式，发展硅光代工业务：通过与国际芯片厂商如英伟达、博通等厂商建立战略合作关系，共同开发基于硅光制程以及逻辑芯片的异构集成技术，形成技术与商业的双重护城河。...

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