台积电先进封装成关键瓶颈：苹果、NVIDIA要开始争抢产能！

快科技01-09

快科技1月9日消息，随着高性能计算与AI芯片需求持续攀升，台积电的先进封装产能正成为半导体产业新的关键瓶颈。市场分析指出，过去在台积电封装路线上各自分流的苹果与NVIDIA，可能将首度在高端3D封装产能上展开正面竞争。长期以来，苹果主要采用台积电的InFO封装技术（主要在AP3产线），用于iPhone的A系列处理器。而NVIDIA则是CoWoS封装的最大客户（占据AP5、AP6产线），专注于AI ...

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