传联发科已从移动芯片部门抽调资源，加码ASIC研发

芯智讯01-05

1月5日消息，据台媒《工商时报》报导，随着人工智能（AI）热潮持续升温，联发科决定调整内部资源，已经将移动芯片部门的部分人力资源转往ASIC、汽车芯片等新市场，希望抓住数据中心与云服务厂商（CSP）所需的定制化芯片商机。报道称，谷歌代号为“Ironwood” 的云端AI芯片“TPU v7”已成为业界首款足以挑战英伟达（ NVIDIA ） Blackwell GPU的ASIC芯片，而联发科则负责设计...

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