100%液冷系统！黄仁勋CES 2026官宣NVIDIA Rubin平台量产，强调散热革新成核心突破

同壁财经01-06

当地时间2026年1月5日，拉斯维加斯CES 2026展会核心环节，NVIDIA创始人兼CEO黄仁勋发表主题演讲，重磅官宣新一代旗舰AI计算平台Vera Rubin（简称“Rubin平台”）正式进入全面量产阶段。根据官方规划，首批基于该平台的全栈解决方案已完成供应链爬坡，将于2026年第三季度启动全球交付。作为NVIDIA继Blackwell架构后的战略级升级成果，Rubin平台以“六芯一体”极端...

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Huang Renxun officially announced mass production of NVIDIA Rubin platform at CES 2026, emphasizing heat dissipation innovation as a core breakthrough","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDU":0.6,"NVD":0.6,"NVD3.UK":0.6,"SNVD.UK":0.6,"NVDS.UK":0.6,"NVIW.SI":0.6,"NVDX":0.6,"002600":1.87,"3NVD.UK":0.6,"NVDD":0.6,"NVDY":0.6,"NVD2.UK":0.6,"NVDS":0.6,"2NVD.UK":0.6,"NVDA":1.98},"content_text":"当地时间2026年1月5日，拉斯维加斯CES 2026展会核心环节，NVIDIA创始人兼CEO黄仁勋发表主题演讲，重磅官宣新一代旗舰AI计算平台Vera Rubin（简称“Rubin平台”）正式进入全面量产阶段。根据官方规划，首批基于该平台的全栈解决方案已完成供应链爬坡，将于2026年第三季度启动全球交付。作为NVIDIA继Blackwell架构后的战略级升级成果，Rubin平台以“六芯一体”极端协同设计突破算力天花板，而针对2.3kW超高功耗芯片打造的全栈散热解决方案，成为本次发布的核心亮点，也为AI算力从“千卡级”向“万卡级”规模化扩张扫清关键障碍。全液冷无风扇设计，实现精准高效温控系统架构层面，Rubin平台实现100%全液冷覆盖，采用第三代完全无缆化设计重构硬件形态，旗舰产品Vera Rubin NVL72机架式系统采用无缆化、无风扇模块化设计，构建“精准温控+高效换热”的整机散热生态。分析师多维解读：散热革新重塑行业格局摩根士丹利相关分析师从产业机遇角度补充：“Rubin平台散热方案升级将带动液冷核心组件需求爆发，其中下一代Vera Rubin NVL144平台预计单个机柜的冷却组件总价值将达到5.57万美元，这一数值较上一代GB300平台增长17%。具备精密加工能力和全栈解决方案能力的液冷供应商将迎来显著市场机遇。”从价值量变化趋势来看，英伟达AI服务器液冷组件价值量随平台迭代呈持续攀升态势：作为Blackwell架构主力的GB200 NVL72系统，单机柜液冷组件价值量约为4.15万美元；迭代至GB300 NVL72平台后，该数值提升20%至4.99万美元；而Rubin架构的NVL144平台在此基础上再增17%，突破5.57万美元大关。这一趋势背后核心驱动因素是芯片功耗的持续突破——GB200单卡功耗约1000W，GB300提升至1400W，Rubin GPU更是达到2.3kW，倒逼散热方案从技术升级，直接推高了液冷组件的价值量。英伟达液冷供应链关键玩家随着英伟达Rubin平台全液冷方案的量产落地及液冷需求的爆发式增长，一批具备核心技术与规模化交付能力的A股企业已切入英伟达液冷供应链，成为全球AI算力散热保障的重要支撑。这些企业凭借技术创新与精密制造优势，覆盖冷板、机柜结构件、整体散热解决方案等关键环节，分享液冷赛道高增长红利。领益智造（002600）通过收购立敏达切入英伟达核心液冷供应链，依托立敏达AVL/RVL认证资质，核心供应冷板（Liquid Cooling Plate）、分水器（Manifold）、液冷快接头（UQD/NVQD）等部件。这些部件在Rubin系统中合计价值52920美元，占散热系统总价值95%。同时，立敏达自主研发的UQD/NVQD液冷快接头已成功通过英特尔牵头的通用快接头互插互换联盟兼容性测试，这一认证不仅验证了其产品在接口通用性、连接稳定性上的行业领先水平，更使其具备了跨厂商设备适配能力，为后续拓展更多算力设备客户奠定基础；2024年，立敏达还携该系列快接头及适配Rubin平台的液冷板、分水器等核心产品亮相英伟达GPU技术大会（GTC），集中展示了与英伟达全栈液冷方案的深度适配成果，其技术实力获得英伟达官方及行业伙伴的高度认可。当前，受益于Rubin平台量产带来的核心液冷部件需求放量，立敏达正加速推进产能扩张计划，重点提升冷板、快接头等核心产品的产能规模，同时计划拓展更多适配Rubin平台的散热部件品类，有望进一步提升在英伟达液冷供应链中的份额占比。行业影响与展望：算力竞争进入“能效决胜”新阶段行业普遍认为，Rubin平台的量产及100%全液冷散热技术突破具有里程碑意义，不仅成功解决了2.3kW超高功耗芯片的散热瓶颈，更标志着AI计算平台正式进入“系统级能效竞争”新阶段。在摩尔定律逼近物理极限、先进制程成本指数级增长的背景下，NVIDIA全栈协同实现散热革新，既破解了上一代Blackwell平台的散热相关连接故障问题，更推动液冷组件价值量随平台迭代持续攀升——从GB200的4.15万美元/机柜，到GB300的4.99万美元，再到Rubin NVL144的5.57万美元，这一趋势直接激活了全球液冷供应链的增长潜力。对国内产业链而言，以领益智造旗下立敏达（供应Rubin散热系统95%核心部件）、英维克（服务谷歌及国内头部互联网厂商）为代表的A股企业，已凭借技术认证与适配能力切入英伟达核心供应链，将直接受益于Rubin平台量产带来的需求放量，同时也有望借助此次合作积累的高功率液冷技术经验，进一步拓展全球算力设备客户。黄仁勋预判，未来5年AI将推动全球10万亿美元规模的计算产业现代化改造，而算力能效比将成为企业核心竞争指标。值得关注的是，其透露2027年下半年预计推出的Vera Rubin Ultra，机架功率将高达600kW，这将进一步推动液冷技术迭代升级。长远来看，全栈散热技术已成为下一代计算平台的核心竞争壁垒，不仅将加速物理AI、智能体系统、数字孪生等前沿应用落地，更将重塑全球AI算力供应链格局，推动行业从“算力竞赛”向“能效竞赛”深度转型。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.42.0","shortVersion":"4.42.0","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2601669178","isCrawlerRequest":true}