天通股份：Bonding+Smart Cut（离子注入法）是通过高能离子轰击实现精准掺杂

证券日报网01-08

证券日报网1月8日讯，天通股份在接受调研者提问时表示，Bonding+SmartCut(离子注入法)是通过高能离子轰击实现精准掺杂，主要工艺步骤涉及衬底埋氧层制备、离子注入、晶圆键合、退火分离、CMP抛光等。该工艺路线优点在于均匀性较好，缺点则是由于异质材料的热膨胀系数不同，退火过程中晶格损伤风险较高。Bonding+Grinding(直接键合法)则是通过分子间力实现晶圆无胶结合，主要工艺步骤涉及...

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