蓝思科技将展TGV玻璃基板及存储技术

DoNews01-05

蓝思科技将在CES 2026展示针对E级超算开发的TGV玻璃基板与玻璃存储技术。TGV玻璃基板即半导体玻璃基板，是下一代先进封装技术的关键原料之一，支持以较低成本实现大规模高速异构互联；玻璃介质具备优异的存储密度上限与耐久能力，部分企业已启动商业化开发。蓝思科技还将展出面向AI数据中心的全栈式液冷解决方案、高精度机柜、光互联通信系统。此外，高自由度仿生灵巧手与头部总成、超薄柔性玻璃、高散热背板、...

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