2nm芯片制程战火升级!高通(QCOM.US)重返三星从单押台积电转向双代工链

智通财经01-07

智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面向OC、...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2601087668?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-01-07 20:41","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2601087668","market":"hk","top_or_hot":-1,"title":"2nm芯片制程战火升级!高通(QCOM.US)重返三星 从单押台积电转向双代工链","media":"智通财经","content":"<div>\n<p>智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面向OC、...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1390042.html\">网页链接</a>\n\n</div>\n","source":"stock_zhitongcaijing","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>2nm芯片制程战火升级!高通(QCOM.US)重返三星 从单押台积电转向双代工链</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n2nm芯片制程战火升级!高通(QCOM.US)重返三星 从单押台积电转向双代工链\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-01-07 20:41 北京时间&nbsp;&nbsp;&nbsp;<a href=http://www.zhitongcaijing.com/content/detail/1390042.html><strong>智通财经</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面向OC、...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1390042.html\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4503","symbol_name":"景林资产持仓","start_time":0,"source_url":"http://www.zhitongcaijing.com/content/detail/1390042.html","article_id":"2601087668","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2601087668","pubTimestamp":1767789666,"columns":[],"sourceInfo":{"source_id":"stock_zhitongcaijing","name":"智通财经网"},"weMediaInfo":null,"summary":"智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙的话报道称，高通很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。报道补充称，这项潜在的交易也将标志着高通在多年来几乎完全依赖台积电进行最为先进的芯片制程代工之后，重返三星电子的前沿芯片制造节点。高通重返三星电子怀抱，对于台积电与英特尔而言意味着什么?","collect":0,"end_time":0,"defaultTopTitle":"zhitongcaijing.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"BK4503":"景林资产持仓","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU0109392836.USD":"富兰克林科技股A","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","BK4602":"量子计算概念","LU1069344957.HKD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (HKD) INC","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","LU0861579265.USD":"联博低波幅策略股票基金A","BK4505":"高瓴资本持仓","LU0175139822.USD":"AB FCP I Global Equity Blend A USD","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","LU0965509283.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (SGDHDG) INC","LU1868837722.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"2\" (USD) ACC","BK4605":"半导体精选","LU2089283258.USD":"安联环球可持续基金Cl AM Dis","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","LU2041044095.USD":"Blackrock Circular Economy A2 USD","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","BK4561":"索罗斯持仓","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","BK4604":"机器人概念","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","LU0689626769.HKD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (HKD) ACC","IE00BVYPNQ40.USD":"GUINNESS ASIAN EQUITY INCOME \"C\" (USD) ACC","BK4527":"明星科技股","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","IE00BVYPNP33.GBP":"GUINNESS ASIAN EQUITY INCOME \"C\" (GBP) ACC","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","BK4526":"热门中概股","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","IE00BSNM7G36.USD":"NEUBERGER BERMAN SYSTEMATIC GLOBAL SUSTAINABLE VALUE \"A\" (USD) ACC","LU2271345857.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (HKD) ACC","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","BK4575":"芯片概念","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0082616367.USD":"摩根大通美国科技A（dist）","SG9999015986.USD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (USD) ACC","LU2360108059.USD":"BGF CIRCULAR ECONOMY \"A4\" (USD) INC","BK4612":"AI芯片","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","QCOM":"高通","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","BK4579":"人工智能","LU1023057109.AUD":"BGF CHINA \"A2\" (AUDHDG) ACC","LU1917777945.USD":"安联专题基金Cl AT Acc","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","SG9999002232.USD":"Allianz Global High Payout USD","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","SG9999002224.SGD":"Allianz Global High Payout SGD","LU0079474960.USD":"联博美国增长基金A","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","BK4573":"虚拟现实","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC","BK4581":"高盛持仓","BK4532":"文艺复兴科技持仓","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","BK4543":"AI","LU0143863784.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"DU\" (USD) ACC","BK4512":"苹果概念","SG9999015978.USD":"利安颠覆性创新基金A","LU2211815571.USD":"ALLIANZ POSITIVE CHANGE \"AT\" (USD) ACC","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","BK4534":"瑞士信贷持仓","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","BK4141":"半导体产品","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","LU1046421795.USD":"富达环球科技A-ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","BK4533":"AQR资本管理(全球第二大对冲基金)","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","03145":"华夏亚洲高息股","BK4591":"室温超导概念","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2063271972.USD":"富兰克林创新领域基金","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","LU0143863198.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"AU\" (USD) ACC","LU0124676726.USD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (USD) ACC","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","BK4515":"5G概念","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","LU1037948897.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (HKD) INC","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU0965508806.USD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (USD) INC","LU0359202008.SGD":"Blackrock China Fund A2 SGD-H","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","LU2298321311.HKD":"BGF CIRCULAR ECONOMY \"A\" (HKDHDG) ACC","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","BK4548":"巴美列捷福持仓","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","LU0238689110.USD":"贝莱德环球动力股票基金","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","LU1934455194.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (USD) ACC","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","LU2092937221.SGD":"Blackrock Circular Economy A2 SGD-H","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","04335":"英特尔-T","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","BK4554":"元宇宙及AR概念","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0823414478.USD":"法巴经典能源转换基金","LU0056508442.USD":"贝莱德世界科技基金A2","LU0868494708.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) INC","SG9999001424.SGD":"United E-Commerce Fund SGD","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","LU2089284900.SGD":"Allianz Global Sustainability Cl AM Dis H2-SGD","LU2860962120.EUR":"CPR INVEST - ARTIFICIAL INTELLIGENCE \"A2\" (EUR) ACC A","BK4585":"ETF&股票定投概念","LU1261432733.SGD":"Fidelity World A-ACC-SGD","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","IE00BGHQDM52.EUR":"GUINNESS ASIAN EQUITY INCOME \"C\" (EUR) ACC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","LU0359201612.USD":"贝莱德中国基金A2","LU0878004406.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) INC","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU1496350502.SGD":"FRANKLIN DIVERSIFIED DYNAMIC \"A\" (SGDHDG) ACC","SGXZ81514606.USD":"大华环球创新基金A Acc USD","LU0158827948.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"A\" (USD) INC","LU0882747503.HKD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (HKD) INC","LU1823568750.SGD":"Fidelity Global Technology A-ACC SGD","BK4588":"碎股","BK4550":"红杉资本持仓","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","LU2357125470.USD":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) ACC","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","BK4598":"佩洛西持仓","LU0942090050.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD)  INC","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","LU0359201885.HKD":"BGF CHINA \"A2\" (HKD) ACC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC"},"translate_title":"The war on the 2nm chip manufacturing process escalates! Qualcomm (QCOM.US) returns to Samsung, shifting from single bet on TSMC to dual foundry chains","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"04335":1.86,"QCOM":1.95,"03145":0.6},"content_text":"智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面向OC、智能手机甚至数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将来实现大规模代工以及全面商业化。报道补充称，这项潜在的交易也将标志着高通在多年来几乎完全依赖台积电(TSM.US)进行最为先进的芯片制程代工之后，重返三星电子的前沿芯片制造节点。在周一，台积电台股股价一度飙升6.9%，股价再度创下历史新高，推动中国台湾股市基准指数突破3万点关口。这一涨势发生在华尔街金融巨头高盛将台积电的12个月内目标价大幅上调35%至2330新台币之后，进一步强化了市场对于人工智能相关算力基础设施需求长期强劲增长的信心。台积电台股最新收于1675新台币，在美股市场，台积电美股ADR2026年开年以来已经大幅上涨8%，市值接近2万亿美元。自2023年以来需求火爆的AI GPU，以及近期需求炸裂的AI ASIC都离不开台积电。台积电目前为全球最大规模的合同芯片代工厂商，随着布局AI的狂热浪潮未见降温之势且继续席卷全球，其客户英伟达以及AMD、博通等芯片巨头，持续从市场对于AI最核心基础设施——AI芯片的激增趋势中受益。这些芯片巨头对台积电的芯片代工合约规模激增，进而推动台积电自去年以来业绩持续超预期强劲扩张，这也是台积电台股以及美股ADR股价近年来屡创新高的重要逻辑支撑。台积电与英特尔的先进芯片制程布局有着“全球芯片代工之王”称号的台积电方面同样全面聚焦于2nm及以下这一最先进芯片制程产能，该公司在其官网制程介绍中明确写到：2nm(N2)“已于2025年第四季度(4Q25)按计划开始量产”，并强调N2采用第一代 nanosheet(纳米片)晶体管(即 GAA/环绕栅极方向)。台积电官网同时标注Fab 20与Fab 22为 2nm先进制程芯片生产设施。近期媒体进一步披露，台积电初期量产/爬坡的重心更偏向高雄Fab 22。相较N3E制程(等同于3nm先进制程)，N2约可实现同功耗下性能+10%到15%，或同性能下功耗缩减25%~30%，以及晶体管密度 +15%~20%(具体取决于芯片架构设计)。另一芯片制造巨头英特尔，则跳过2nm整数制程，聚焦于1.8nm级别制程(即18A)。英特尔表示，18A已经从“制程节点承诺”走到“终端产品发布与量产爬坡”，而 14A 仍在研发与路线图/客户导入阶段。英特尔在CES 2026重磅发布/展示了基于18A制程打造的 Panther Lake(Core Ultra Series 3)，并将其作为18A的“首批产品平台”对外确认。18A 的关键工艺特征，即GAA/RibbonFET + 背面供电PowerVia，也作为该代产品与制程卖点被媒体与英特尔官方材料同步强调，但是具体的生产良率指标仍未公布。高通重返三星电子怀抱，对于台积电与英特尔而言意味着什么?高通过去几年在领先制程上“几乎完全依赖台积电”，而此次若把下一代移动AP的一部分先进节点订单转向三星2nm，意味着高通在“最核心、最量大的手机SoC”上启动双供应链策略或者分散化，会在份额与议价权层面对台积电形成轻微压力，但是对于台积电基本面增长前景无任何重大扰动。高通选择三星代工移动端处理器，更像“客户风险对冲与产能/成本再平衡”，并不必然代表台积电在2nm竞争力受质疑;台积电仍可能保有高通相当庞大的份额(比如来自高通的AIPC核心芯片以及即将推出数据中心AI推理芯片)，且整体高端产能在AI/HPC几乎无止境的强劲需求下通常不愁产能消化，加之苹果公司早已锁定台积电一部分2nm产能，台积电2026年甚至需要大举扩张先进制程芯片产能。对于英特尔的代工前景而言则可能是重大打击。在英特尔正努力用18A以及更加先进节点争取外部大客户、强化芯片代工增长叙事的阶段，高通若优先回到三星而非英特尔，等于英特尔在“高端移动端SoC这个标志性客户”上短期仍难获得实质性验证。18A与更加先进的16A技术可以说是英特尔能否翻身的关键节点，因此对于业绩长期萎靡的英特尔的增长前景来说，掌握领先全球且极度适合量产的先进制程芯片制造技术可谓至关重要。这家美国老牌芯片巨头甚至不惜购置更加昂贵的High-NA EUV光刻机——这也是阿斯麦所交付的全球第一台High-NA，英特尔力争打造出领先于台积电以及三星电子的2nm及以下最先进芯片制造技术。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.42.0","shortVersion":"4.42.0","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2601087668","isCrawlerRequest":true}

2nm芯片制程战火升级!高通(QCOM.US)重返三星 从单押台积电转向双代工链

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2nm芯片制程战火升级!高通(QCOM.US)重返三星从单押台积电转向双代工链