CES上，这些芯片巨头也在“秀肌肉”

读创客户端01-07

深圳商报·读创客户端首席记者王海荣当地时间1月6日，2026年国际消费电子展（CES 2026）在美国拉斯维加斯拉开帷幕。作为全球规模最大、影响力最广的科技盛会之一，本届CES展示了人工智能技术从云端走向现实世界，全面渗透至机器人、汽车、XR设备乃至日常家电之中的新态势。在这场技术变革的浪潮中，芯片厂商尤其是英伟达的表现尤为抢眼，成为全球科技界与资本市场关注的焦点。除了英伟达、AMD两大GPU...

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（图片来源于Intel公众号）据悉，首批搭载第三代Intel酷睿Ultra处理器的消费级笔记本电脑将于2026年1月27日起在全球范围内面市。搭载第三代Intel酷睿Ultra处理器的边缘系统预计将于2026年第二季度开始面市。高通彻底跳出移动业务“舒适区”在CES 2026上，以智能手机芯片闻名的高通技术公司正加速“去手机化”，通过三大战略方向展示其转型决心：智能汽车、具身智能机器人和工业级边缘AI，标志着这家芯片巨头已彻底跳出手机业务“舒适区”。在汽车领域，高通凭借“骁龙数字底盘”解决方案强势领跑。其旗舰产品——骁龙座舱平台至尊版与Snapdragon Ride平台至尊版，已获得多家车企的新车型定点。此外，高通还推出行业首款汽车5G RedCap调制解调器A10，为车联网提供低成本、低功耗连接支持。图片说明：高通展示在汽车领域的应用。 （图片来源于高通官网）与此同时，高通将AI能力延伸至物理世界，正式推出完整的机器人技术栈。全新发布的高通跃龙IQ10系列处理器，专为人形机器人与工业自主移动机器人设计。搭载高通跃龙IQ9系列处理器的人形机器人在高通展台进行了现场演示，彰显其从“感知”迈向“行动”的具身智能布局。在更广泛的物联网与工业场景，高通通过过去18个月对Augentix、Arduino、Edge Impulse等五家公司的收购，构建起覆盖芯片、软件、安全与开发工具的完整边缘AI生态。新推出的跃龙Q-8750处理器AI算力高达77 TOPS，可在终端侧运行百亿参数大模型；而Qualcomm 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