富士通牵手软银，日本半导体抱团研发HBM替代品

爱集微01-03

日前，富士通正式官宣加入软银牵头的下一代AI内存开发项目，将与软银、英特尔及东京大学组成联盟，打造“SAIMEMORY新型内存”媒体报道称，此次合作聚焦大型语言模型等复杂AI计算需求，旨在突破现有存储技术瓶颈，该联盟将以三维堆叠DRAM技术打造高带宽内存（HBM）的直接替代品，研发兼具高性能与经济性的存储器解决方案，为AI基础设施建设提供全新选择。作为项目核心参与者之一，富士通将自身深耕多年的量子...

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