英伟达挑战HBM极限

半导体芯闻2025-12-30

如果您希望可以时常见面，欢迎标星收藏哦~随着人工智能（AI）算力需求的爆发式成长，全球AI 芯片龙头英伟达（Nvidia）正准备再次推高全球AI 记忆体供应链的技术极限。根据市场消息来源指出，英伟达已正式向主要供应商发出需求，评估最早于2026 年第四季交货16 层堆叠HBM的可行性。如此迫使三星电子（Samsung Electronics）、SK 海力士（SK hynix）与美光（Micron...

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记忆体供应链的技术极限。根据市场消息来源指出，英伟达已正式向主要供应商发出需求，评估最早于2026 年第四季交货16 层堆叠HBM的可行性。如此迫使三星电子（Samsung Electronics）、SK 海力士（SK hynix）与美光（Micron...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230184857a6e10644&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2111349929.HKD","symbol_name":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230184857a6e10644&s=b","article_id":"2595878791","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230184857a6e10644&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, 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limits","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SNVD.UK":0.6,"NVDS.UK":0.6,"NVDU":0.6,"NVIW.SI":0.6,"NVD2.UK":0.6,"NVDY":0.6,"3NVD.UK":0.6,"NVDS":0.6,"2NVD.UK":0.6,"NVD":0.6,"NVDA":1.97,"NVD3.UK":0.6,"NVDD":0.6},"content_text":"如果您希望可以时常见面，欢迎标星 收藏哦~随着人工智能（AI）算力需求的爆发式成长，全球AI 芯片龙头英伟达（Nvidia）正准备再次推高全球AI 记忆体供应链的技术极限。根据市场消息来源指出，英伟达已正式向主要供应商发出需求，评估最早于2026 年第四季交货16 层堆叠HBM的可行性。如此迫使三星电子（Samsung Electronics）、SK 海力士（SK hynix）与美光（Micron Technology）加速研发时程，更提前开启了下一代AI 芯片的核心零件争夺战。根据韩国媒体报导，目前市场焦点仍集中在12 层堆叠HBM4 的供应商认证与量产准备上，预计12 层堆叠的产品将于2026 年初进入全面商业化阶段。然而，英伟达显然不满足于此，近期已经在询问下一代产品的状况。虽然，整个计画尚未签署正式合约，但已引发供应商内部的开发时程重新规划，包括良率目标与初始产量设定的动荡。部分供应商预计，相关的效能评估最快将于2026 年第三季前展开。根据规格与时程的最终定案，这款16 层堆叠的产品目前可能仍被归类为HBM4 世代，或者是HBM4E 世代的范围。韩国半导体工业协会执行副总裁、前SK 海力士高层Ahn Ki-hyun 指出，英伟达对GPU 的升级非常积极，这使得HBM 也必须以相同的节奏前进。如果记忆体效能跟不上，即使是更高性能的GPU 也会失去意义。事实上，从12 层堆叠推进到16 层堆叠，其关键并非只是简单的层数堆叠而已，而是半导体封装技术的重大进步。 Ahn Ki-hyun 强调，要从12 层堆叠到16 层堆叠的转换在技术上远比8 层堆叠到12 层堆叠更为艰难，许多情况下必须更换整个制成技术。以目前的规格来分析，从12 层堆叠推进到16 层堆叠，面临的最大挑战在于封装高度与晶圆厚度上：晶圆厚度缩减：为了在有限的空间内堆叠更多芯片，业界估计16 层堆爷的HBM 需要将晶圆厚度从目前12 层堆爷设计的50 微米，进一步压缩至30 微米左右。封装高度限制：全球半导体标准组织JEDEC 将HBM4 的封装高度限制在775 微米，这为传统的堆叠方法留下的空间极其有限。以上这些物理限制使得封装键合（Bonding）技术成为竞争的核心。目前，三星与美光主要依赖热压键合（TCB）技术，而SK 海力士则采用其领先业界的批量回流模制底填（MR-MUF）技术。面对16 层HBM 的挑战，各大记忆体巨头采取了截然不同的技术路径。在三星方面，当前已经考虑在16 层堆叠的产品中导入“混合键合”（Hybrid Bonding）技术。分析认为，三星之所以选择提前转向混合键合，是因为其在目前的黏合剂技术竞争中难以赶上对手，希望借此新技术实现弯道超车。近期，三星在英伟达的HBM4 系统封装（SiP）测试中已获得正面的回馈。至于，SK 海力士方面，正在调节其发展节奏。虽然该公司也正在开发混合键合作为备案，但其战略重点是尽可能延长其业界领先的MR-MUF 技术的寿命。目前，SK 海力士已建立HBM4 量产框架，并开始向英伟达提供有偿样品。最后在美光部分，虽然在最新进展中较少被提及，但美光仍与三星同样依赖TCB 技术，并正努力在16 层堆爷的竞赛中保持竞争力。报导强调，这场技术竞赛的关键时间点将与英伟达下一代Rubin 架构AI 芯片的发表连结，该产品预计于2026 年下半年问世。据悉，每颗Rubin 架构AI 芯片将配备多达8 个HBM4 堆叠，这将极大的拉动对高层数HBM 的需求。不过，尽管业界对16 层堆叠的HBM4 充满期待，但短期内市场重心仍将稳固在HBM3E。根据市场分析师估计，HBM3E 在2026 年仍将占HBM 总产量的66%，虽然较2025年的87% 有所下降，但依然是市场绝对的主流。（来源：综合整理自网络信息）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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