GMIF观察 | HBM4 2月量产！三星与SK海力士谁能率先稳供AI大厂？

GMIF创新观察2025-12-30

据韩媒 SEdaily 最新报道称，三星与SK海力士已确认将于2026年2月同步启动HBM4的大规模量产。这将是HBM技术史上首次两大厂商在同一时间窗口推出新一代产品，标志着AI内存竞争已进入技术、产能、良率与交付节奏全面比拼的新阶段。（图片来源：SK海力士官网）01HBM4量产绑定头部客户HBM4 Mass Production SecuresPartnerships with Leading ...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2595798386?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-12-30 16:39","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2595798386","market":"us","top_or_hot":-1,"title":"GMIF观察 | HBM4 2月量产！三星与SK海力士谁能率先稳供AI大厂？","media":"GMIF创新观察","content":"<div>\n<p>据韩媒 SEdaily 最新报道称，三星与SK海力士已确认将于2026年2月同步启动HBM4的大规模量产。这将是HBM技术史上首次两大厂商在同一时间窗口推出新一代产品，标志着AI内存竞争已进入技术、产能、良率与交付节奏全面比拼的新阶段。（图片来源：SK海力士官网）01HBM4量产绑定头部客户HBM4 Mass Production SecuresPartnerships with Leading ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230164410a6e08951&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>GMIF观察 | HBM4 2月量产！三星与SK海力士谁能率先稳供AI大厂？</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nGMIF观察 | HBM4 2月量产！三星与SK海力士谁能率先稳供AI大厂？\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-12-30 16:39 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230164410a6e08951&s=b><strong>GMIF创新观察</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>据韩媒 SEdaily 最新报道称，三星与SK海力士已确认将于2026年2月同步启动HBM4的大规模量产。这将是HBM技术史上首次两大厂商在同一时间窗口推出新一代产品，标志着AI内存竞争已进入技术、产能、良率与交付节奏全面比拼的新阶段。（图片来源：SK海力士官网）01HBM4量产绑定头部客户HBM4 Mass Production SecuresPartnerships with Leading ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230164410a6e08951&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2065171402.SGD","symbol_name":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230164410a6e08951&s=b","article_id":"2595798386","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251230164410a6e08951&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2595798386","pubTimestamp":1767083993,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"据韩媒 SEdaily 最新报道称，三星与SK海力士已确认将于2026年2月同步启动HBM4的大规模量产。英伟达已确认其下一代数据中心GPU架构“Rubin”将于2025年第三季度起逐步上市，明确要求高带宽内存的稳定供应，这正成为推动存储大厂加速HBM4量产的关键驱动力。小编观点：HBM4量产在即，三星与SK海力士虽同步起跑，但胜负关键已不在参数，而在于谁能更稳、更快地满足英伟达等大客户的定制化需求与交付节奏。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU2065171402.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) INC","LU2552382215.SGD":"WELLINGTON US BRAND POWER \"A\" (SGDHDG) ACC","2NVD.UK":"2X NVIDIA ETP","LU1267930490.SGD":"TEMPLETON GLOBAL EQUITY INCOME \"AS\" (SGD) INC A","LU0342679015.USD":"ALLIANZ GLOBAL EQUITY UNCONSTRAINED \"AT\" (USD) ACC","LU1721428933.USD":"法巴全球经典环境基金RH MD Dis","LU0472753341.HKD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU2552382058.USD":"WELLINGTON US BRAND POWER \"A\" (USD) ACC","LU2168564495.EUR":"AZ ALLOCATION - TREND \"AI\" (EUR) ACC","LU0057025933.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (USD) ACC","LU2552382132.HKD":"WELLINGTON US BRAND POWER \"A\" (HKD) ACC","NVDY":"NVDA期权收益策略ETF-YieldMax","LU2168564222.USD":"AZ ALLOCATION - TREND \"AAZ\" (USDHDG) ACC","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","NVD2.UK":"2X NVIDIA ETP","LU0029864427.USD":"TEMPLETON GLOBAL \"A\" (USD) INC","LU0511384066.AUD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (AUDHDG) ACC","NVDD":"1倍做空NVDA ETF-Direxion","LU2168564065.EUR":"AZ ALLOCATION - TREND \"AAZ\" (EUR) ACC","NVD3.UK":"LS 3X NVIDIA","SG9999018857.SGD":"United Global Quality Growth Fd Cl Acc SGD-H","3NVD.UK":"LS 3X NVIDIA","NVDU":"2倍做多NVDA ETF-Direxion","IE00BYXW3230.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"AA\" (USD) ACC","LU0128525929.USD":"TEMPLETON GLOBAL \"A\" (USD) ACC","LU2168563687.JPY":"AZ ALLOCATION - TREND \"AAZ\" (JPYHDG) ACC","NVDS.UK":"LS -1X NVIDIA","IE00B775H168.HKD":"JANUS HENDERSON BALANCED \"A5M\" (HKD) INC","HBM":"HudBay Minerals Inc","LU1633808545.USD":"ALLIANZ GLOBAL EQUITY GROWTH \"AT\" (USD) ACC","NVDS":"1.5倍做空NVDA ETF-Tradr","LU1992135472.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES \"AT\" (HKD) ACC","NVIW.SI":"NVDA 3xLongSG261006","LU2602419157.SGD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"AC\" (SGD) ACC","LU0354030438.USD":"富国美国大盘成长基金Cl A Acc","SNVD.UK":"LS -1X NVIDIA","LU0965508806.USD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (USD) INC","NVD":"2倍做空NVDA ETF-GraniteShares","LU1232071149.USD":"AZ FUND 1 GLOBAL GROWTH SELECTOR \"AAZ\" (USDHDG) ACC","LU2505996681.GBP":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (GBPHDG) INC","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","LU1720051108.HKD":"ALLIANZ GLOBAL ARTIFICIAL INTELLIGENCE \"AT\" (HKD) ACC","NVDA":"英伟达","LU2505996509.AUD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (AUDHDG) INC","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU2065171311.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) ACC","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC"},"translate_title":"GMIF Observation | HBM4 will be mass-produced in February! Who can take the lead in stabilizing supply to major AI manufacturers, Samsung or SK Hynix?","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDS":0.6,"NVDY":0.6,"NVDD":0.6,"SNVD.UK":0.6,"NVDS.UK":0.6,"NVD":0.6,"2NVD.UK":0.6,"NVDA":0.9,"NVIW.SI":0.6,"NVD3.UK":0.6,"NVD2.UK":0.6,"NVDU":0.6,"3NVD.UK":0.6,"HBM":0.64},"content_text":"据韩媒 SEdaily 最新报道称，三星与SK海力士已确认将于2026年2月同步启动HBM4的大规模量产。这将是HBM技术史上首次两大厂商在同一时间窗口推出新一代产品，标志着AI内存竞争已进入技术、产能、良率与交付节奏全面比拼的新阶段。（图片来源：SK海力士官网）01HBM4量产绑定头部客户HBM4 Mass Production SecuresPartnerships with Leading Customers（图片来源：TrendForce 官网）作为AI芯片的关键配套组件，HBM4的量产进度与英伟达、AMD等头部算力厂商的新一代GPU发布节奏紧密关联。英伟达已确认其下一代数据中心GPU架构“Rubin”将于2025年第三季度起逐步上市，明确要求高带宽内存的稳定供应，这正成为推动存储大厂加速HBM4量产的关键驱动力。事实上，每一次GPU架构的升级，几乎都伴随着一轮HBM出货的高峰。在此背景下，据业内人士透露，SK海力士已宣布完成HBM4量产准备工作，并计划于2026年2月在利川M16和清州M15X工厂启动大规模生产；而三星也确认将在同期于平泽园区开启HBM4量产。两家公司均表示正与主要客户进行最后阶段的验证，以确保产品按时交付。02从性能比拼到客制化博弈From Performance Competition toCustomization GameHBM4不仅是一次性能跃升，更标志着高带宽内存正式迈入客制化时代，技术路线随之分化：SK海力士通过与台积电合作，在HBM4的基底Die上导入12nm制程工艺，相较前代产品实现带宽翻倍、能效比提升逾40%。三星依托其Turnkey方案与先进制程优势主动出击，率先导入10nm工艺，并在内部评估中达成11.7Gbps的行业领先速率，正朝着2026年2月量产的目标稳步推进。在此基础上，其HBM4产能将优先投向英伟达下一代AI加速器系统“Vera Rubin”（计划2026年下半年发布），其余部分则分配给谷歌第七代TPU（张量处理单元）的生产需求。随着头部客户对定制深度和交付确定性的要求不断提高，HBM4的竞争已不再局限于性能参数，而是延伸至技术协同、供应链响应与长期合作能力的全方位较量。03高带宽带动产业红利High Bandwidth IgnitesIndustry Dividends（图片来源：中商情报网）HBM4的激烈竞争正引发全球存储产业链的连锁反应。Counterpoint预测，2025年全球HBM市场规模将突破300亿美元，到2027年有望翻倍。这一高增长前景正吸引上下游企业加速布局。据业内人士透露，先进封装设备订单已排至2026年；受HBM高堆叠结构带来的散热挑战驱动，高端导热材料需求显著攀升，日本相关供应商订单激增。在此轮HBM产业链高景气带动下，A股半导体板块情绪持续回暖，截至2025年12月中下旬，中证半导体指数等主流指数年内累计涨幅已超过50%。与此同时，以长鑫存储为代表的中国企业也已启动HBM4预研，瞄准2026年之后的AI芯片市场。小编观点：HBM4量产在即，三星与SK海力士虽同步起跑，但胜负关键已不在参数，而在于谁能更稳、更快地满足英伟达等大客户的定制化需求与交付节奏。技术路线分化背后，是生态协同能力的较量——从制程整合到封装验证，响应速度决定订单归属。对国内厂商而言，2026年或是切入中端AI市场的关键窗口，唯有加速技术预研与供应链适配，方能在全球HBM新格局中争取一席之地。关于GMIF创新观察GMIF创新观察，是 GMIF 创新峰会的内容与传播平台。我们以媒体与研究的方式记录行业趋势，以市场化办会方式提升峰会体验与专业度，持续赋能服务产业伙伴，为行业提供深度、客观的洞见与观察。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2595798386","isCrawlerRequest":true}