应对 AI 服务器高功耗挑战：罗姆的功率半导体创新与生态合作布局

芯师爷2025-12-26

在如今全球高端算力吃紧的时候，此前微软有大量GPU被闲置在库房吃灰的新闻曾一度引起行业热议。之所以会出现这样的“奇观”，主要是由于电力和数据中心基础设施的不足，导致这些昂贵的英伟达GPU无法充分发挥其算力。AI服务器是不折不扣的“吃电怪兽”，传统单机柜的功率在5-10kW，而如今AI服务器的功率则升至30-100kW以上，并向MW（兆瓦）级迈进。以英伟达的产品为例，其 H 系列功耗为 700 w，...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251226081312a47933f9&s=b><strong>芯师爷</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>在如今全球高端算力吃紧的时候，此前微软有大量GPU被闲置在库房吃灰的新闻曾一度引起行业热议。之所以会出现这样的“奇观”，主要是由于电力和数据中心基础设施的不足，导致这些昂贵的英伟达GPU无法充分发挥其算力。AI服务器是不折不扣的“吃电怪兽”，传统单机柜的功率在5-10kW，而如今AI服务器的功率则升至30-100kW以上，并向MW（兆瓦）级迈进。以英伟达的产品为例，其 H 系列功耗为 700 w，...</p>\n\n<a 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layout","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDY":0.6,"NVIW.SI":0.6,"3NVD.UK":0.6,"NVD":0.6,"2NVD.UK":0.6,"NVD3.UK":0.6,"NVD2.UK":0.6,"SNVD.UK":0.6,"NVDU":0.6,"NVDA":0.9,"SOXX":0.6,"SMH":0.6,"NVDD":0.6,"NVDS.UK":0.6,"NVDS":0.6,"NVDX":0.6},"content_text":"在如今全球高端算力吃紧的时候，此前微软有大量GPU被闲置在库房吃灰的新闻曾一度引起行业热议。之所以会出现这样的“奇观”，主要是由于电力和数据中心基础设施的不足，导致这些昂贵的英伟达GPU无法充分发挥其算力。AI服务器是不折不扣的“吃电怪兽”，传统单机柜的功率在5-10kW，而如今AI服务器的功率则升至30-100kW以上，并向MW（兆瓦）级迈进。以英伟达的产品为例，其 H 系列功耗为 700 w，2025年的 B 系列已翻倍至 1.4 kW，其计划2027年推出的芯片VR300达3.6kW。从增长趋势来看，通用服务器电力消耗逐年递增，而 AI 服务器的电力消耗以 “倍数级” 速度增长。根据相关机构的预测，至2030年，保守预测数据中心电力消耗将达到全球电力消耗的 1/10。1如何应对高功耗挑战？面对人工智能对电力资源的疯狂需求，总体而言有两条路线，一方面是开源，即多发电，利用好太阳能、风能、核能等，另一方面则是节流，让数据中心的能耗更低、综合能源利用率更高。对数据中心和设备上而言，在区域发电量相对恒定的状态下，降低功耗的方法或许更为靠谱，这是节省成本的重要方式。罗姆半导体（上海）有限公司深圳分公司技术中心总经理水原徳健近期在媒体交流会上表示，AI服务器功耗持续攀升，将带来严峻的挑战，如电力损耗和发热增加、铜材消耗与成本、空间压力、扩展性受限、运营成本高等。图源 | 罗姆值得一提的是，仅数据中心每年在电力资源方面的投入就非常值得其驱动相关的芯片供应链去开发更低功耗的解决方案。根据Uptime Institute 2024年的调查，北美大型数据中心一年的电力成本占其当年运营成本比重在40%以上。科技公司和AI实验室正在建设的数据中心，有些甚至消耗高达1吉瓦或更多的电力，相当于超过80万户家庭的用电量，其规模堪比一座中型城市。在此背景下，AI服务器电源架构逐渐转向高压。目前微软、谷歌、Meta 等企业组成的 Open Compute Project 联盟推动的 ±400 V系统，而英伟达也在推800 V系统。中国市场正在探讨最适合自身的路线：是直接从54V过渡到400V，还是迈向800V，抑或未来直接瞄准1500V？虽然最终标准未定。总体而言，服务器电源架构 “高压化”趋势毫无争议，而且链路非常清晰。AI爆发 → 功耗激增 → 电力瓶颈 → 倒逼设备能效提升 → 电源侧（AC/DC, DC/DC）与IT侧（功率密度）是两大关键 → 对半导体厂商提出三大要求：①开发更高效率、更高功率密度的功率器件；②提供成熟的高压技术，需要芯片商、设备商、服务器厂商紧密协作；③建立全球化的质量、成本、交付、服务（QCDS）体系保障供应。2罗姆能提供什么方案？在AI服务器领域，罗姆半导体能提供什么独到的解决方案和价值？水原徳健表示，罗姆半导体最大的优势在于，公司是全球少数同时拥有功率器件和模拟技术的半导体企业，这也是核心竞争力。在功率器件领域，罗姆覆盖硅（Si）、碳化硅（SiC）、氮化镓（GaN）三种核心材料，可根据不同功率、频率需求提供对应的产品，同时，罗姆还能提供与功率器件配套的驱动器、AC/DC、DC/DC 等模拟芯片，可向客户提供一站式整体解决方案。据水原徳健介绍，罗姆在AI服务器供电架构中，罗姆主要聚焦于两个关键部分，其一是电源侧，提供全面的碳化硅 MOSFET和二极管，特别是1200V产品，采用多种封装（TO-247，贴片等），导通电阻极低。使用碳化硅是实现效率从98%迈向99%以上的关键。其二服务器侧的DC/DC分为一次侧和二次侧，一次侧罗姆提供1200伏SiC产品，二次侧则提供各种Si产品及GaN方案。这部分主要是DC/DC低压产品，电压范围在80伏到150伏，要求开关损耗更小、导通电阻更低。罗姆相关产品可使功率密度达到129瓦/立方英尺。若追求更高功率密度，使用GaN可使功率密度再提高一倍，达到246瓦/立方英尺。罗姆碳化硅已演进至第4代，第5代样品已开始出货，明年将投入批量生产（相较前代，损耗降低30%）。规划中的第6代、第7代迭代速度将更快，以匹配GPU的快速迭代节奏。在封装方面，罗姆也在持续创新，提供从传统TO封装到创新的DOT-247（双芯合一）、HSDIP20模块等丰富选择，助力客户实现小型化、易设计。热插拔功能是保障AI服务器在线维护、不停机扩容的基础，这一技术广泛应用于服务器、存储设备、网络设备等关键基础设施中。其核心挑战在于抑制热插拔瞬间产生的浪涌电流，防止后续电路损坏。在这方面，罗姆提供了关键MOSFET、电流检测电阻和热插拔控制器等产品的支持。其核心产品RY7P250BM和RS7P200BM采用Nch MOSFET技术，具有宽SOA（安全工作区）范围和低导通电阻特点，确保了热插拔过程中的稳定性和可靠性。水原徳健表示，RY7P250BM已被全球知名主流云平台企业认证为推荐器件。值得一提的是，罗姆不止提供极具竞争力的解决方案，还与行业龙头展开深度战略合作，积极共建生态，与行业一同为攻克AI数据中心的功耗难题提供解题思路。当前罗姆氮化镓产品应用于台达 48 W输出 AC 适配器、 EcoSiC™ 产品应用于村田 AI 服务器、支持科索 3.5kW 输出 AC - DC 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