中天精装：公司参股企业科睿斯半导体科技（东阳）有限公司主营FCBGA高端封装基板业务

证券日报 2025-12-25

登录新浪财经APP 搜索【信披】查看更多考评等级证券日报网讯 12月25日，中天精装在互动平台回答投资者提问时表示，公司参股企业科睿斯半导体科技（东阳）有限公司主营FCBGA高端封装基板业务，产品应用于TPU/CPU/GPU/AI 芯片等高算力芯片的封装，项目（一期）于2025年9月启动投产。科睿斯当前正在为部分客户打样，各项进展顺利。公司将持续关注和支持参股企业经营发展情况，如出现对外投资...

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