下一代晶圆级冷却：TSMC、Meta、Google等迈向液冷

DT半导体2025-12-22

00引言在2024年IEEE ECTC一篇题为《Moving Towards Microchannel‑Based Chip Cooling（迈向基于微通道的芯片冷却）》的技术论文正式发布。这篇论文不仅在技术层面具有极高的参考价值，其作者阵容同样引人注目，作者来自多家全球领先机构与企业，包括SEMI、KLA、EVG、Meta、TSMC、HP、Google 以及 ASE。01台积电（TSMC）台积电...

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