台积电CoPoS设备2026年年中落地，海外供应商冲击台企

半导体产业研究2025-12-22

图片来源：DIGITIMES受益于AI GPU及ASIC需求激增，台积电及非台积电阵营均上调了2026年晶圆级系统集成封装（CoWoS）产能规划。值得关注的是，受CoWoS供应短缺及英伟达需求影响，台积电的晶圆代工订单正逐步外溢至安靠、日月光等外包半导体封装测试（OSAT）厂商，引发市场对台积电可能流失市场份额的担忧。设备供应商表示，对台积电而言，让OSAT厂商承接部分订单是一种风险分散策略：若...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251222192109a6c13e6b&s=b><strong>半导体产业研究</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>图片来源：DIGITIMES受益于AI GPU及ASIC需求激增，台积电及非台积电阵营均上调了2026年晶圆级系统集成封装（CoWoS）产能规划。值得关注的是，受CoWoS供应短缺及英伟达需求影响，台积电的晶圆代工订单正逐步外溢至安靠、日月光等外包半导体封装测试（OSAT）厂商，引发市场对台积电可能流失市场份额的担忧。设备供应商表示，对台积电而言，让OSAT厂商承接部分订单是一种风险分散策略：若...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251222192109a6c13e6b&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0264606111.USD","symbol_name":"Janus Henderson Horizon Asian Dividend Income A2 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GPU及ASIC需求激增，台积电及非台积电阵营均上调了2026年晶圆级系统集成封装（CoWoS）产能规划。值得关注的是，受CoWoS供应短缺及英伟达需求影响，台积电的晶圆代工订单正逐步外溢至安靠、日月光等外包半导体封装测试（OSAT）厂商，引发市场对台积电可能流失市场份额的担忧。设备供应商表示，对台积电而言，让OSAT厂商承接部分订单是一种风险分散策略：若供需关系突然反转，台积电可迅速响应，而大举投入的OSAT厂商将首当其冲。此外，台积电已掌控先进封装的产能需求与技术进程，且CoWoS作为成熟技术，订单可见度清晰。台积电已将布局重心转向CoPoS技术，其初期设备供应商名单与CoWoS高度重叠，但仍可能存在调整空间。泛林集团、东京电子、科磊（KLA）等国际巨头均拟扩大出货份额，积极推进设备研发；而技术或良率无法跟上节奏的台湾地区供应商，其CoWoS订单增长势头可能逐渐减弱。试点产线与量产时间表台积电计划2026年在硅品精密（VisEra）搭建首条CoPoS试点产线，目前已有多家厂商在筹备设备。量产基地将设在嘉义AP7晶圆厂，目标2026年年中完成设备安装，2028年底实现全面量产。供应商多元化策略回顾台积电此前公布的CoPoS初期供应商名单及设备规格，多数与CoWoS供应商重叠。为分散风险并提升议价能力，台积电新增了多家新晋合格供应商。主要设备供应商以欧美日大厂为主，包括泛林集团、东京电子（TEL）、科磊（KLA）、应用材料、Heller、N&K、维易科（Veeco）、斯克林（Screen）、佳能（Canon）、迪思科（Disco）、山田（Yamada）、罗泽（Rorze）、Suss、普发真空（Pfeiffer Vacuum）等。初期入围的中国台湾地区厂商包括APT、Scientech、GPTC、GMM、致茂电子、C Sun、帆宣（Favite）、Taliang、V5、Leading Precision、Nivek、固锝（Gudeng）等。行业消息人士指出，台积电CoWoS设备采购计划将持续至2026年底，目前产能规划、设备安装及量产时间表均已确定，供应名单与规模大概率不会出现重大变动，设备供应链正聚焦CoPoS订单释放。竞争压力加剧鉴于部分厂商在运营、定价谈判、技术及良率方面仍存在差异，且考虑到台积电的大额订单规模，海外供应商正积极扩大设备研发以争夺订单。因此，与海外同行直接竞争的台湾地区厂商，若缺乏价格或良率优势，将面临显著的替代风险。CoPoS生态链供应商表示，相较于CoWoS，CoPoS的设备设计复杂度大幅提升；加之台积电的扩产承诺，中国台湾地区厂商在土地购置、厂房建设及人力方面将面临更高的成本与风险。中国市场因素增添复杂性设备供应商还指出，除台积电与日月光外，中国内地正加速推进先进封装研发，其设备采购价格显著低于台积电，因此许多供应商正与中国内地企业展开低调合作。不过，据悉台积电对中国内地营收占比较高的供应商管控更为严格，此举未来是否会影响CoPoS供应商名单，备受市场关注。原文标题：TSMC's CoPoS equipment set for mid-2026; overseas suppliers shake up Taiwan firms原文媒体：digitimes 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