英伟达B100、H200芯片全面采用液冷散热机构称国产厂商或迎发展新机遇

格隆汇2025-12-24

格隆汇12月24日｜据腾讯财经，上证报昨日称，英伟达B100/H200已全面采用液冷散热，随着英伟达GB300系列AI服务器机柜自2025年底起的量产，以及预计2026年下半年起Vera Rubin平台的落地，液冷价值量进一步提升。最新市场预测显示，英伟达GB300AI服务器机柜明年出货量有望达到5.5万台，同比增长129%，主要由微软、Meta等巨头驱动。此外，第五届国际AIDC液冷供应链千人...

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Rubin平台的落地，液冷价值量进一步提升。最新市场预测显示，英伟达GB300AI服务器机柜明年出货量有望达到5.5万台，同比增长129%，主要由微软、Meta等巨头驱动。此外，第五届国际AIDC液冷供应链千人峰会于12月18-19日举行。同时，全球AI巨头加速液冷技术应用，谷歌宣布将2026年TPU芯片出货量目标大幅上调50%至600万颗。 英伟达B100、H200芯片已升级液冷散热方案，行业景气度持续提升。中信证券表示，当前液冷产业链以台系厂商为主。随着芯片厂商逐步参与液冷供应链选择，国产厂商迎来重大机遇。看好国产厂商充分受益AIDC液冷需求放量，推荐具备液冷核心组件量产能力及整体解决方案的厂商。中信建投指出，2025年是服务器液冷的“爆发元年”，新方案迭代利好国产厂商。市场预期GB300机柜第四季度大量出货，当前处于液冷零部件上量的关键时间节点。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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英伟达B100、H200芯片全面采用液冷散热 机构称国产厂商或迎发展新机遇

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英伟达B100、H200芯片全面采用液冷散热机构称国产厂商或迎发展新机遇