不止于2纳米：苹果押注WMCM封装，争夺芯片能效制高点

电子半导体观察12-18

点击上方蓝字，关注我们苹果即将推出的iPhone 18已引发行业高度关注，尤其是围绕其芯片封装技术升级的传闻不断涌现。最新消息显示，苹果可能在明年的A20和A20 Pro芯片中，放弃当前使用的InFO（集成扇出型）封装，转向更先进的WMCM（晶圆级多芯片模组）封装方案，此举有望大幅提升芯片的散热表现。WMCM封装是一种在晶圆层级进行系统集成的技术，它将SoC、DRAM等多个核心组件在切割前就直接...

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efficiency","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPL":1.95,"MACW.SI":0.6},"content_text":"点击上方蓝字，关注我们苹果即将推出的iPhone 18已引发行业高度关注，尤其是围绕其芯片封装技术升级的传闻不断涌现。最新消息显示，苹果可能在明年的A20和A20 Pro芯片中，放弃当前使用的InFO（集成扇出型）封装，转向更先进的WMCM（晶圆级多芯片模组）封装方案，此举有望大幅提升芯片的散热表现。WMCM封装是一种在晶圆层级进行系统集成的技术，它将SoC、DRAM等多个核心组件在切割前就直接构建于晶圆之上。这种方式的优势在于，无需依赖传统的中介层或封装基板来实现芯片间互连，从而在提升集成度的同时，显著改善信号传输效率和热管理能力。随着半导体工艺不断逼近物理极限，行业共识是：仅靠制程微缩已不足以支撑持续的性能进步。封装与散热设计正成为释放芯片潜力的关键。若上述传闻成真，A20系列芯片将兼具台积电2纳米制程的能效优势与WMCM封装的结构红利，有望在持续高负载场景——如长时间游戏运行或端侧AI任务处理中，提供更稳定、强劲的性能输出。供应链信息进一步透露，台积电已在其位于嘉义的AP7新厂区布局下一代先进封装产线。该厂区二期工程规划为WMCM专用生产线，预计将主要承接苹果未来的芯片订单。除了封装技术的潜在升级，苹果在整机散热方案上也可能继续突破。iPhone 18 Pro系列预计将延续真空腔均热板散热系统，并有望将同类方案首次引入折叠屏机型iPhone Fold，以应对更大屏幕与更强性能带来的散热挑战。值得关注的是，即便在当前一代芯片竞争中，苹果A19 Pro已在能效与持续性能释放上表现出色。有测试显示，即使对比搭载主动散热系统（如风扇+液冷）的安卓旗舰平台，A19 Pro仍能在实际体验中保持优势。若A20系列成功引入WMCM封装并配合2纳米制程，其性能表现或将进一步拉开与竞品的距离，重塑高端移动芯片的市场格局。（电子半导体观察 ID:gh_19b781f0bf52）扫码关注我们电子半导体观察了解更多相关资讯","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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