中国移动研究院携手飞腾打造无线“中国芯”实现规模突破

光纤在线2025-12-17

12/17/2025，光纤在线讯，2025年12月11日，在南京举办的中国移动供应链生态合作大会上，由中国移动研究院与中国电子飞腾公司联合定制的无线核心CPU S5000C-M正式亮相。近期在中国移动5G扩展型皮基站集采中，全部中标厂商均搭载此款芯片。这不仅意味着价值数亿元的订单落地，更标志着国产CPU首次在无线通信设备上实现规模化商用，完成了从技术突破到市场应用的关键跨越。实现突破：五年攻坚，...

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FT2000+的第一代国产化小基站，实现“从无到有”突破的基础上。双方组建CPU联合攻关组，将5G基站需求转化为芯片规格，启动国内首款面向无线设备的核心CPU深度定制研发，采用国产ARM指令集、集成专用加解密硬件加速单元，显著提升效率、降低功耗；同时为顺应网络云化趋势，在虚拟化方面进行了专项增强。在流片前，团队针对国产工艺制约导致的晶圆尺寸超标难题，自主研发业界首套面向5G设备的硅前仿真测试方案，优化缓存设计，以最小性能代价解决了工艺瓶颈。S5000C-M于2022年底成功流片。测试表明，该芯片性能可比肩国外主流x86平台，且在整机功耗与综合成本上具备明显竞争优势。为了加速S5000C-M规模应用，中国移动开展整机研制，并牵头在全国多省份建设大规模国产化试验网，组织多家厂商开展现网商用测试，加速整机设备成熟。在福建外场的大容量测试中排名第一、在工业低时延及高带宽场景中，搭载S5000C-M的设备表现稳定，为其大规模应用奠定了坚实基础。历经五年，无线国产核心CPU成功实现了“从无到有”到“从有到优”的跨越。协同与展望：构建开放生态，迈向未来演进S5000C-M的成功不仅是单点芯片的突破，更是产业链协同创新的成果。中国移动与中国电子发挥各自“链长”作用，双方以芯片为核心，协同超过30家上下游企业，共同构建了涵盖硬件平台、加速库、安全引擎在内的完整解决方案，显著降低了设备商的研发门槛与产品上市周期。这种“芯片+参考设计+生态”的创新合作模式，促进了基于自主技术的产业链形成，构建起开放、解耦的良性生态。随着5G向6G演进，网络正朝着通信、计算、智能深度融合的方向发展，对底层算力平台的开放性、智能化与融合能力提出了更高要求。以S5000C-M为起点，中国移动与飞腾公司将继续协同创新，共同构建面向未来的通信计算融合新格局，推动自主创新之路持续向前延伸。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":1,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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