台积电有望 2026H2 提升 CoWoS 先进封装 CoW 阶段委外规模

IT之家2025-12-16

IT之家 12 月 16 日消息，作为目前最为成熟、产能最充足的 2.5D 先进封装集成技术，台积电的 CoWoS 一直是各大 AI 芯片企业争夺的焦点，台积电也正不断对此扩产。而在 CoWoS 或类似先进封装的生态系统中，几大 OSAT 巨头也是不可忽略的一部分。以日月光 (ASE) 及旗下硅品 (SPIL)、Amkor 安靠为代表的封测企业已为台积电分担了不少 CoWoS 后段 oS 部分的...

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