SK 海力士携手英伟达攻坚前沿 AI 存储：剑指 1 亿 IOPS，性能约为现有产品 30 倍

IT之家2025-12-11

IT之家 12 月 11 日消息，科技媒体 ZDNet Korea 昨日（12 月 10 日）发布博文，报道称 SK 海力士正加速布局下一代 AI 存储技术，该公司已联手英伟达（NVIDIA）共同开发“AI-NAND”，有望突破存储性能瓶颈。在 2025 人工智能半导体未来技术会议（AISFC）上，SK 海力士副社长 Kim Cheon-sung 表示，其公司正与全球 AI 芯片巨头英伟达展开紧密...

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Korea 昨日（12 月 10 日）发布博文，报道称 SK 海力士正加速布局下一代 AI 存储技术，该公司已联手英伟达（NVIDIA）共同开发“AI-NAND”，有望突破存储性能瓶颈。在 2025 人工智能半导体未来技术会议（AISFC）上，SK 海力士副社长 Kim Cheon-sung 表示，其公司正与全球 AI 芯片巨头英伟达展开紧密合作，致力于开发代号为“AI-N P”（性能型 AI NAND）的次世代存储解决方案。作为“AIN Family”产品线的一环，该方案旨在通过重构 NAND 与控制器的架构，打破 AI 运算与存储之间的数据传输瓶颈，以满足大规模 AI 推演环境对数据吞吐的极致需求。IT之家援引博文介绍，SK 海力士计划于 2026 年底发布基于 PCIe Gen 6 接口的初期样品，该产品将支持高达 2500 万 IOPS（每秒读写次数）。考虑到目前数据中心主流的高性能企业级 SSD（eSSD）最大 IOPS 约为 300 万，新产品的性能将实现约 8 至 10 倍的跨越式提升。图源：hankyung该公司已着手研发第二代产品，目标是在 2027 年底将性能进一步推高至 1 亿 IOPS，达到现有产品的 30 倍以上。为了应对 AI 数据中心和端侧 AI 的多样化需求，SK 海力士正在构建包含 AI-N P（性能）、AI-N B（带宽）和 AI-N D（容量）的完整产品矩阵。公司目前正与英伟达就 AI-N P 进行联合概念验证（PoC），重点优化大规模数据吞吐时的能效与速度，通过针对性的优化，将有效缓解存储系统在处理海量 AI 数据时的延迟问题，确保 GPU 算力不被存储短板所拖累。除性能型产品外，SK 海力士还在高带宽存储领域取得了进展。Kim Cheon-sung 表示，公司正与闪迪共同推进“AI-N B”的标准化工作。图源：hankyung该产品在业内被称为 HBF（高带宽闪存），其原理类似 HBM（高带宽内存），通过堆叠 NAND 闪存来大幅扩展数据传输带宽，他预计 AI-N B 的 Alpha 版本将于 2026 年 1 月底面世，并在 2027 年推出正式样品以供评估，这将为 AI 存储架构提供全新的技术路径。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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