Arm未来5年将在韩国培养1400名半导体IP设计专业人才

IT之家2025-12-09

作为软银董事长孙正义、Arm CEO 雷内・哈斯 (Rena Hass) 韩国访问成果的一部分，Arm 当地时间本月 5 日与韩国产业通商资源部签署了《强化韩国半导体与 AI 产业》谅解备忘录 (MoU)。根据这份备忘录，Arm 将同产业通商资源部一道在明年设立“Arm 学校”，目标在未来五年内培养 1400 名半导体 IP 设计专业人才，以补足韩国在 Fabless、晶圆代工等系统半导体领域的...

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