台积电、日月光、Amkor及联电等加速扩产CoWoS

格隆汇12-10

格隆汇12月10日｜据台湾电子时报，半导体设备厂商透露，台积电与日月光集团、Amkor与联电等都在加速扩充先进封装CoWoS产能，从订单分布观察，2026~2027年GPU、ASIC客户需求均超出预期。其中，英伟达持续预订台积CoWoS过半产能，博通与AMD分别占据二、三名。

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