千亿CPO市场争夺战全面爆发！台积电、三星、英特尔决战2027，共封装光学如何重构AI数据中心格局？

半导体行业小报10:18

在AI算力需求爆炸式增长的当下，共封装光学（CPO）技术正成为决定下一代数据中心性能的关键战场。随着数据传输需求从当前的800G向1.6T迈进，传统可插拔光模块已接近物理极限，而CPO技术通过将光引擎与计算芯片共同封装，有望将传输速度提升10倍，功耗降低50%。这场技术革命吸引了全球超过150家企业布局，从晶圆代工厂、芯片巨头到云计算厂商，全部投身这场千亿规模的产业争夺战。代工厂军备竞赛：三星、...

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