SiC衬底的两大新兴应用方向，打开通向未来产业的想象空间

中国粉体网12-08

中国粉体网讯近期，晶盛机电董事长曹建伟在一次演讲中提到，碳化硅衬底除了新能源汽车这一核心赛道之外，还涌现出两大新兴应用方向：一是先进封装领域，‌碳化硅因优异的散热性能，台积电正在推进碳化硅衬底在CoWoS封装中的应用，以解决AI芯片高功耗和散热问题；二是光学领域，以META为代表的企业在光学镜片中引入碳化硅材料，进一步拓展了碳化硅的应用边界。这些新赛道的崛起，改变了行业对碳化硅衬底尺寸的预期。原本...

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