IEDM 2025前瞻：半导体“奥运会”上的存储革命，铠侠跨界DRAM激战三星

橙芯视界12-06 20:55

即将在美国旧金山召开的IEDM 2025（IEEE国际电子器件会议），正吸引着全球半导体产业的目光。作为微电子器件领域最权威的年度会议，IEDM被誉为半导体界的“奥林匹克”。与CES展示“当下能买到的产品”不同，IEDM展示的是未来5至10年的技术物理极限。英特尔的FinFET、台积电的GAA等改变世界的工艺，均最初在此首发。在今年的赛场上，存储技术的未来形态成为了焦点。作为全球唯一的NAND闪存...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2589251048?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-12-06 20:55","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2589251048","market":"us","top_or_hot":-1,"title":"IEDM 2025前瞻：半导体“奥运会”上的存储革命，铠侠跨界DRAM激战三星","media":"橙芯视界","content":"<div>\n<p>即将在美国旧金山召开的IEDM 2025（IEEE国际电子器件会议），正吸引着全球半导体产业的目光。作为微电子器件领域最权威的年度会议，IEDM被誉为半导体界的“奥林匹克”。与CES展示“当下能买到的产品”不同，IEDM展示的是未来5至10年的技术物理极限。英特尔的FinFET、台积电的GAA等改变世界的工艺，均最初在此首发。在今年的赛场上，存储技术的未来形态成为了焦点。作为全球唯一的NAND闪存...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251206210305a727a57a&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>IEDM 2025前瞻：半导体“奥运会”上的存储革命，铠侠跨界DRAM激战三星</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIEDM 2025前瞻：半导体“奥运会”上的存储革命，铠侠跨界DRAM激战三星\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-12-06 20:55 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251206210305a727a57a&s=b><strong>橙芯视界</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>即将在美国旧金山召开的IEDM 2025（IEEE国际电子器件会议），正吸引着全球半导体产业的目光。作为微电子器件领域最权威的年度会议，IEDM被誉为半导体界的“奥林匹克”。与CES展示“当下能买到的产品”不同，IEDM展示的是未来5至10年的技术物理极限。英特尔的FinFET、台积电的GAA等改变世界的工艺，均最初在此首发。在今年的赛场上，存储技术的未来形态成为了焦点。作为全球唯一的NAND闪存...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251206210305a727a57a&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1623119135.USD","symbol_name":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251206210305a727a57a&s=b","article_id":"2589251048","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251206210305a727a57a&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2589251048","pubTimestamp":1765025756,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"即将在美国旧金山召开的IEDM 2025，正吸引着全球半导体产业的目光。作为微电子器件领域最权威的年度会议，IEDM被誉为半导体界的“奥林匹克”。CXMT将发布面向3D DRAM的氧化物晶体管技术，并已在300mm晶圆上完成了试产和可靠性评估。此次IEDM上，台积电将探讨氧化物半导体在无电容DRAM及强诱电体存储器上的应用可能性。“橙芯”视点IEDM 2025的技术风向标表明，存储产业正在经历一场从结构到材料的底层重构。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU0143863784.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"DU\" (USD) ACC","LU2211815571.USD":"ALLIANZ POSITIVE CHANGE \"AT\" (USD) ACC","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4612":"AI芯片","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2063271972.USD":"富兰克林创新领域基金","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU0143863198.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"AU\" (USD) ACC","LU0124676726.USD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (USD) ACC","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","LU1037948897.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (HKD) INC","SMH":"半导体指数ETF-HOLDRs","BK4581":"高盛持仓","BK4532":"文艺复兴科技持仓","LU0965508806.USD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (USD) INC","LU0359202008.SGD":"Blackrock China Fund A2 SGD-H","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","SOXX":"iShares费城交易所半导体ETF","LU2298321311.HKD":"BGF CIRCULAR ECONOMY \"A\" (HKDHDG) ACC","BK4543":"AI","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","BK4534":"瑞士信贷持仓","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","BK4141":"半导体产品","LU0238689110.USD":"贝莱德环球动力股票基金","LU1934455194.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (USD) ACC","LU2092937221.SGD":"Blackrock Circular Economy A2 SGD-H","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","BK4591":"室温超导概念","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0823414478.USD":"法巴经典能源转换基金","LU0056508442.USD":"贝莱德世界科技基金A2","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU2089284900.SGD":"Allianz Global Sustainability Cl AM Dis H2-SGD","LU2860962120.EUR":"CPR INVEST - ARTIFICIAL INTELLIGENCE \"A2\" (EUR) ACC A","LU0861579265.USD":"联博低波幅策略股票基金A","BK4548":"巴美列捷福持仓","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","LU0878004406.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) INC","LU0359201612.USD":"贝莱德中国基金A2","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","BK4554":"元宇宙及AR概念","SGXZ81514606.USD":"大华环球创新基金A Acc USD","LU0882747503.HKD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (HKD) INC","LU0158827948.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"A\" (USD) INC","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC","BK4585":"ETF&股票定投概念","LU2357125470.USD":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) ACC","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","03145":"华夏亚洲高息股","LU0359201885.HKD":"BGF CHINA \"A2\" (HKD) ACC","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","BK4550":"红杉资本持仓","BK4588":"碎股","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU0109392836.USD":"富兰克林科技股A","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","BK4512":"苹果概念","LU0175139822.USD":"AB FCP I Global Equity Blend A USD","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","LU0965509283.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (SGDHDG) INC","LU1868837722.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"2\" (USD) ACC","LU2089283258.USD":"安联环球可持续基金Cl AM Dis","LU2041044095.USD":"Blackrock Circular Economy A2 USD","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","BK4503":"景林资产持仓","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","BK4602":"量子计算概念","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","TSM":"台积电","LU0689626769.HKD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","BK4505":"高瓴资本持仓","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","SOX":"费城半导体指数","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","LU2271345857.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (HKD) ACC","BK4605":"半导体精选","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0082616367.USD":"摩根大通美国科技A（dist）","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU2360108059.USD":"BGF CIRCULAR ECONOMY \"A4\" (USD) INC","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","LU1023057109.AUD":"BGF CHINA \"A2\" (AUDHDG) ACC","BK4527":"明星科技股","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","LU1917777945.USD":"安联专题基金Cl AT Acc","BK4526":"热门中概股","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC"},"translate_title":"IEDM 2025 preview: The storage revolution at the semiconductor \"Olympics\", Kioxia cross-border DRAM fiercely battles Samsung","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SOXX":0.6,"03145":0.6,"TSM":0.9,"SOX":1.84,"SMH":0.6},"content_text":"即将在美国旧金山召开的IEDM 2025（IEEE国际电子器件会议），正吸引着全球半导体产业的目光。作为微电子器件领域最权威的年度会议，IEDM被誉为半导体界的“奥林匹克”。与CES展示“当下能买到的产品”不同，IEDM展示的是未来5至10年的技术物理极限。英特尔的FinFET、台积电的GAA等改变世界的工艺，均最初在此首发。在今年的赛场上，存储技术的未来形态成为了焦点。作为全球唯一的NAND闪存专营巨头，日本铠侠（Kioxia）宣布将在此次会议上发布基于氧化物半导体的3D DRAM技术。这标志着铠侠试图利用新材料，在传统DRAM微缩遇阻的关口实现弯道超车。与此同时，三星电子、SK海力士以及中国厂商长鑫存储（CXMT），也纷纷押注这一技术路线，一场围绕AI存储新形态的战争已经打响。氧化物半导体引领DRAM 3D化浪潮1. 铠侠的跨界反击：OCTRAM与8层堆叠尽管铠侠的主业是NAND，但其正在利用在NAND领域积累的成熟3D堆叠工艺经验，开发名为OCTRAM的次世代DRAM。技术核心：铠侠采用了氧化物半导体IGZO（铟镓锌氧化物）作为基本素子。相比传统硅材料，IGZO具有极低的漏电流特性，非常适合低功耗应用。最新进展：在本次IEDM上，铠侠将展示其成功实现的IGZO晶体管8层垂直堆叠结构，并验证了良好的电气特性。这意味着DRAM可以像NAND一样，通过增加层数来提升容量，打破了传统平面DRAM的微缩极限。キオクシアホールディングスは酸化物半导体を使うDRAMの开発を进める2. 三星与CXMT的全面跟进氧化物DRAM已成为巨头必争之地。三星电子：将联合三星综合技术院（SAIT）展示面向10nm以下制程的垂直沟道型氧化物晶体管技术。其核心突破在于使用了**InGaO（铟镓氧化物）材料，并验证了在550℃**高温工艺下性能不退化，这对于后续的3D集成制造至关重要。长鑫存储（CXMT）：中国厂商并未缺席。CXMT将发布面向3D DRAM的氧化物晶体管技术，并已在300mm晶圆上完成了试产和可靠性评估。尽管受限于EUV设备管制，CXMT在次世代存储架构的探索上依然保持了紧跟第一梯队的节奏。铠侠在2024年IEDM上发布了“OCTRAM”3. 台积电的算盘：混载存储器台积电关注氧化物半导体，意在解决逻辑芯片内部的“存储墙”问题。其目标是开发更大容量、更低功耗的片上混载存储器，以替代传统的eDRAM或SRAM。此次IEDM上，台积电将探讨氧化物半导体在无电容DRAM及强诱电体存储器上的应用可能性。4. NAND的新高度：321层与PLC在NAND领域，SK海力士继续领跑。层数突破：SK海力士将披露321层堆叠的3D NAND技术细节，再次刷新行业高度。多值化：同时将发布5bit/cell（PLC）技术。虽然目前QLC（4bit/cell）尚未完全普及，但为了进一步降低成本，PLC的商业化已被提上日程。新材料：美光（Micron）则另辟蹊径，探索将强诱电体材料应用于NAND，以期在提升层数的同时降低功耗。“橙芯”视点IEDM 2025的技术风向标表明，存储产业正在经历一场从结构到材料的底层重构。1. DRAM的“NAND化”趋势铠侠将NAND的堆叠技术引入DRAM，标志着DRAM正式进入了3D时代。传统DRAM依靠缩小平面线宽来提升密度的路径已近尽头，未来的DRAM将像摩天大楼一样向天空生长。氧化物半导体因其低温制程和低漏电特性，成为了实现这一架构转型的关键钥匙。谁能率先解决氧化物材料的可靠性和量产难题，谁就能定义下一代内存标准。2. 存算一体的物理基础台积电对氧化物混载存储器的投入，揭示了AI芯片的未来架构：存储即计算。当SRAM的微缩停滞不前，能直接堆叠在逻辑电路之上的氧化物内存，将成为打破冯·诺依曼瓶颈、大幅提升AI推理能效的杀手锏。3. 中国厂商的韧性在被EUV卡住脖子的情况下，CXMT在3D DRAM等新架构上的积极布局值得关注。这说明在后摩尔时代，通过架构创新来弥补光刻精度的不足，正在成为中国半导体产业突围的一条务实路径。互动探讨铠侠试图用NAND的堆叠经验来做DRAM，这是否意味着未来存储器的界限将逐渐模糊？在3D DRAM时代，您认为决定胜负的关键是光刻精度，还是薄膜沉积与蚀刻的工艺控制能力？","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.35.10","shortVersion":"4.35.10","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2589251048","isCrawlerRequest":true}