台积电先进封装订单大爆满扩大委外释单日月光大赢家

爱集微2025-12-08

台积电先进封装产能大爆满，正扩大委外释单，相关订单外溢效应大开，日月光投控旗下日月光半导体和硅品成为大赢家。因应台积电庞大转单，日月光与硅品近期砸大钱扩产与购买设备。根据公开资讯站资料，日月光与硅品近二个月已斥资逾百亿元新台币扩产迎接大单，凸显台积电外溢订单强劲。日月光投控大咬台积电CoWoS委外订单之余，后续还有新订单落袋。业界透露，最近超火的CoWoP，是一种先进芯片封装架构，主要创新在于跳过...

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PCB）上，台积电将委外由硅品担纲主轴操刀。业界指出，OpenAI开启的生成式AI浪潮，已成为当前科技业发展主轴，带动英伟达、超微等大厂高性能计算（HPC）订单动能爆发性增长，包括微软、Meta、亚马逊AWS及Google等指标大厂都竞相争抢高性能计算产能，需求至少将旺到明年底无虞。台积电是英伟达、AMD高性能计算唯一产能供应商，举凡2nm、3nm先进制程及SoIC、CoWoS先进封装产能都已经被预订一空，让台积电开始加速委外先进封装、先进测试，借此应对AI客户庞大需求。台积电先进封装订单外溢效应大开，日月光投控是最大赢家。日月光投控看好，今年先进封装与测试业务表现强劲，全年先进封装营收可望达成16亿美元目标，并预期2026年将再增加超过10亿美元，增幅逾六成，显示AI与高性能计算需求强劲不坠，带动公司持续加大资本支出，稳固全球半导体封测龙头地位。日月光投控正积极加快扩产脚步，以旗下硅品为例，先前兴建的二林厂、斗六厂都可望在明年准备就绪，加上日月光半导体先前收购稳懋位在高雄路竹厂房，亦可望在明年完成机台进驻，让日月光投控2026年营运成为市场期待的焦点。因应先进封装庞大需求，日月光投控正砸大钱投资。根据日月光投控公告，单是近二个月，包括旗下日月光半导体与硅品，花在取得厂务工程、设备等的资金，合计即高达111.73亿元新台币，后续还可望再有新增投资，透露当下先进封装市场需求相当强劲。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"2","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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台积电先进封装订单大爆满 扩大委外释单 日月光大赢家

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台积电先进封装订单大爆满扩大委外释单日月光大赢家