CoWoP新单日月光有望到手

爱集微12-08 07:07

台积电正携手合作伙伴，积极改善CoWoS产能供不应求之余，传出英伟达正研发全新封装技术“CoWoP”（Chip on Wafer on PCB），并委由日月光投控旗下硅品担纲操刀，对接多家一线PCB厂，再度引爆话题，也让日月光投控身价持续水涨船高。业界人士透露，英伟达传正研发新的封装技术CoWoP，未来可能会省去载板，现阶段整体供应链设计与衔接封测段到量产成本都在初期阶段。外传包含臻鼎-KY、欣兴...

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CoWoP新单 日月光有望到手

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CoWoP新单日月光有望到手