TrendForce：AI需求催生封装变革，ASICs转向EMIB技术

爱集微2025-11-30

TrendForce最新研究显示，AI HPC对异质整合的需求依赖先进封装技术，其中TSMC的CoWoS解决方案是关键技术。然而，随着云端服务业者加速自研ASIC，对封装面积的需求不断扩大，已有CSP开始考虑转向Intel的EMIB技术。TrendForce指出，CoWoS方案通过中介层连接不同功能芯片，目前已发展出CoWoS-S、CoWoS-R与CoWoS-L等技术。随着NVIDIA ...

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千百度
2025-12-05
千百度
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href=\"https://laohu8.com/S/META\">Meta</a>等北美CSP积极与Intel接洽EMIB解决方案。</p><p>相比CoWoS，EMIB具有结构简化、热膨胀系数问题较小、封装尺寸更具优势等特点，能为AI客户提供更具<span>成本优势</span>的解决方案。但EMIB也受限于硅桥面积与布线密度，互连频宽相对较低，延迟性略高，目前仅ASIC客户较积极评估导入。</p><p>TrendForce预测，随着Google决定在2027年TPUv9导入EMIB试用，Meta亦积极评估用于其MTIA产品，EMIB技术有望为Intel Foundry Services业务带来重大进展。至于NVIDIA、<a href=\"https://laohu8.com/S/AMD\">AMD</a>等对频宽、传输速度及低延迟需求较高的GPU供应商，仍将以CoWoS为主要封装解决方案。</p><p>此外，TrendForce还发布2026年十大科技市场趋势预测，涵盖AI服务器、存储器、晶圆代工等领域。2025年第三季度DRAM产业营收达414亿美元，季增30.9%；新能源车销量年增31%，全年预计增长25%；AR显示技术竞争加剧，预估2030年LEDoS技术渗透率达65%。</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>TrendForce：AI需求催生封装变革，ASICs转向EMIB技术</title>\n<style 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margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nTrendForce：AI需求催生封装变革，ASICs转向EMIB技术\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-11-30 11:51 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251130115353a4c310e6&s=b><strong>爱集微</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>TrendForce最新研究显示，AI HPC对异质整合的需求依赖先进封装技术，其中TSMC的CoWoS解决方案是关键技术。然而，随着云端服务业者加速自研ASIC，对封装面积的需求不断扩大，已有CSP开始考虑转向Intel的EMIB技术。TrendForce指出，CoWoS方案通过中介层连接不同功能芯片，目前已发展出CoWoS-S、CoWoS-R与CoWoS-L等技术。随着NVIDIA ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251130115353a4c310e6&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"TSM":"台积电","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","BK4612":"AI芯片","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU1894683348.USD":"AMUNDI FUNDS US EQUITY RESEARCH VALUE \"A2\" (USD) INC","LU0345770993.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) INC","BK4588":"碎股","LU1196500208.SGD":"NORDEA STABLE RETURN \"HB\" (SGDHDG) ACC","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","LU0210533765.USD":"JPM GLOBAL GROWTH 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Cl AMg DIS USD","LU1221951129.SGD":"NORDEA 1 STABLE RETURN \"HM\" (SGDHDG) INC"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251130115353a4c310e6&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2587798406","content_text":"TrendForce最新研究显示，AI HPC对异质整合的需求依赖先进封装技术，其中TSMC的CoWoS解决方案是关键技术。然而，随着云端服务业者加速自研ASIC，对封装面积的需求不断扩大，已有CSP开始考虑转向Intel的EMIB技术。TrendForce指出，CoWoS方案通过中介层连接不同功能芯片，目前已发展出CoWoS-S、CoWoS-R与CoWoS-L等技术。随着NVIDIA Blackwell平台2025年进入规模量产，市场需求已高度倾向内嵌硅中介层的CoWoS-L。然而，CoWoS面临产能短缺、光罩尺寸限制和价格高昂等问题，促使Google、Meta等北美CSP积极与Intel接洽EMIB解决方案。相比CoWoS，EMIB具有结构简化、热膨胀系数问题较小、封装尺寸更具优势等特点，能为AI客户提供更具成本优势的解决方案。但EMIB也受限于硅桥面积与布线密度，互连频宽相对较低，延迟性略高，目前仅ASIC客户较积极评估导入。TrendForce预测，随着Google决定在2027年TPUv9导入EMIB试用，Meta亦积极评估用于其MTIA产品，EMIB技术有望为Intel Foundry Services业务带来重大进展。至于NVIDIA、AMD等对频宽、传输速度及低延迟需求较高的GPU供应商，仍将以CoWoS为主要封装解决方案。此外，TrendForce还发布2026年十大科技市场趋势预测，涵盖AI服务器、存储器、晶圆代工等领域。2025年第三季度DRAM产业营收达414亿美元，季增30.9%；新能源车销量年增31%，全年预计增长25%；AR显示技术竞争加剧，预估2030年LEDoS技术渗透率达65%。","news_type":1,"symbols_score_info":{"INTC":0.84,"TSM":0.9,"03145":0.6}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"CN"}],"isCommentEnd":false,"newsSizeData":{"likeSize":0,"commentSize":1,"repostSize":1,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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