CoWOS，迎来劲敌

半导体行业观察11-26

公众号记得加星标⭐️，第一时间看推送不会错过。近期因为台积电的CoWoS先进封装产能高度吃紧，除了几个AI芯片龙头有能力大量“包产能”外，其他特用芯片（ASIC）和二线的AI芯片业者，难以争取到足够CoWoS产能支援。值得注意的是，市场陆续传出，英特尔（Intel）的EMIB先进封装制程，成为芯片业者的考量之一，半导体业界更盛传，网通芯片大厂Marvell甚至联发科，都积极想要尝试，甚至可能有“...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251126083953a7119b82&s=b><strong>半导体行业观察</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>公众号记得加星标⭐️，第一时间看推送不会错过。近期因为台积电的CoWoS先进封装产能高度吃紧，除了几个AI芯片龙头有能力大量“包产能”外，其他特用芯片（ASIC）和二线的AI芯片业者，难以争取到足够CoWoS产能支援。值得注意的是，市场陆续传出，英特尔（Intel）的EMIB先进封装制程，成为芯片业者的考量之一，半导体业界更盛传，网通芯片大厂Marvell甚至联发科，都积极想要尝试，甚至可能有“...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251126083953a7119b82&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SG9999014559.SGD","symbol_name":"United Income Focus Trust Dis 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rival","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"MACW.SI":0.6,"ON":0.9,"SMH":0.6,"INTC":0.9,"ASIC":1,"TSM":0.9,"03145":0.6,"SOXX":0.6},"content_text":"公众号记得加星标⭐️，第一时间看推送不会错过。近期因为台积电的CoWoS先进封装产能高度吃紧，除了几个AI芯片龙头有能力大量“包产能”外，其他特用芯片（ASIC）和二线的AI芯片业者，难以争取到足够CoWoS产能支援。值得注意的是，市场陆续传出，英特尔（Intel）的EMIB先进封装制程，成为芯片业者的考量之一，半导体业界更盛传，网通芯片大厂Marvell甚至联发科，都积极想要尝试，甚至可能有“前段投片台积电、后段找上英特尔”的新生意模式。英特尔先进封装实力不俗EMIB有吸引力据了解，由于英特尔EMIB技术本身价格较为实惠，散热表现也不错，面对一些技术规格需求相对没那么高的产品，确实是能够支援，部分ASIC厂商如Marvell、联发科传出已经试着透过采用EMIB制程，来提供价格更便宜的方案给客户参考。也有消息表示，EMIB现在已经有“非英特尔”自身的客户确定采用了。事实上，CoWoS产能吃紧的情况并非是现在才发生，已经延续了一段时间，但随着整个市场对于云端AI芯片的投资与需求持续暴增，无论是台积电，还是与其CoWoS制程配合的测试供应链，全都处于产能全满、持续赶单的状态。从台积电高效运算（HPC）相关营收在上一季几乎没有任何季增就可以看出，现有产能确实已经都在运转了。更令市场头痛的是，愈来愈多美系客户对于在美国本土生产有相关需求，虽然台积电的前段晶圆代工制程正陆续到位，但后段制程现在仍得全部运回台湾处理，这就没办法完全符合客户在地制造的需求。产能不足以及美国本地制造的缺口，都使得英特尔的EMIB，变成值得考虑的替代选项。苹果、高通皆有动作英特尔2.5/3D先进封装都是选项包括苹果（Apple）、高通（Qualcomm）近期都默默在招募人才的条件中，加入了需要对EMIB技术有所了解这一环。半导体供应链业者表示，确实以苹果和高通的云端AI芯片技术需求来说，一个应是以自己的云端ASIC为主，另一个则是锁定Tier 2的AI加速卡产品，确实都不一定要用到CoWoS，更具成本效益的EMIB，或许还能为其带来更好的效益。而其他ASIC的专案，如果是针对运算要求相对低一些的推论应用，EMIB确实也可以支援。虽然部分半导体业界人士认为，EMIB技术是为了掩盖英特尔在晶圆电路设计能力的不足，将部分运算需求转移到载板端的做法，但EMIB确实是个发展相对成熟且有一定实绩的技术，要用来支援一些比较紧急，需要在短时间内完成设计到量产的Tier 2专案，确实是做得到的。在现今ASIC与二线AI运算芯片愈来愈强调性价比的大环境下，EMIB是有一些优势存在。 IC设计相关人士表示，和英特尔针对EMIB进行合作测试的业者有在增加的趋势，当然短时间或许还不会有什么很大的出货量，但放眼长期，如果合作的成效不错，2.5D的EMIB，甚或是3D封装的Foveros制程，都有机会稳定接到一些订单。前段投片台积电、后段找上英特尔并非不可能任务供应链业者强调，目前市场上在传的做法，都是要整合台积电的晶圆代工前段制程，和英特尔的EMIB后段制程，要将两者整合在一起，确实还需要花点心思。但对于英特尔来说，考量到其晶圆代工服务目前还没办法说服这些领先大厂，先从后段先进封装的服务开始做，不失为切入AI芯片供应链的一个方式。毕竟CoWoS产能供不应求的这个时间窗口，可能只是暂时的，如果没能把握这个机会争取一些专案来练兵，未来这个先进封装替代方案的生意，就会直接被Amkor或日月光投控、硅品等传统封测代工（OSAT）业者瓜分掉。联发科发言体系指出，对于ASIC相关业务的技术细节，不做任何公开回应。(来源：内容来自digitimes。)*免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 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