传台积电2nm节点PPA提升有限，价格或低于预期

爱集微11-25

此前有消息称，台积电2nm工艺的晶圆成本估计为每片3万美元。据业内人士最新透露，台积电2nm N2节点的功率、性能和面积（PPA）改进有限，其价格并不会如先前预期般高昂。据微博用户“Smart Chip Insider”透露，多个2nm芯片组的研发进展顺利，预计将在2026年正式推出。尽管该用户并未明确指出具体采用台积电2nm N2制程的公司名称，但提到2nm晶圆的价格将不会过于昂贵。这一消息对于...

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N2节点的功率、性能和面积（PPA）改进有限，其价格并不会如先前预期般高昂。据微博用户“Smart Chip Insider”透露，多个2nm芯片组的研发进展顺利，预计将在2026年正式推出。尽管该用户并未明确指出具体采用台积电2nm N2制程的公司名称，但提到2nm晶圆的价格将不会过于昂贵。这一消息对于苹果、高通、联发科等计划采用台积电2nm技术的厂商来说，无疑是一大利好。此前，受内存价格上涨影响，苹果、高通、联发科等厂商在支付台积电高额制程费用之余，还需承担更高的内存成本。据悉，苹果的A20和A20 Pro将率先采用新一代光刻技术制造，随后高通的骁龙8 Elite Gen 6和骁龙8 Elite 6 Pro，以及联发科的天玑9600也将跟进。值得注意的是，有传言称，由于2nm N2制程的PPA改进有限，高通和联发科可能会转向更为先进的2nm ‘N2P’节点，后者相较于2nm N2仅提供5%的性能提升。关于2nm N2制程的具体性能表现，据透露，其相较于3nm ‘N3E’制程仅提供15%的性能提升，功耗降低可达30%。从这些数据来看，从3nm ‘N3P’制程升级到2nm N2制程的优势并不显著，这也印证了此前关于2nm制程PPA改进有限的传闻。（校对/赵月）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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