内存与2nm代工成本上涨高通与联发科面临价格压力

芯智讯11-25

随着半导体制程迈入2nm制程时代，手机芯片大厂高通（Qualcomm）与联发科（MediaTek）都在准备下一代旗舰移动芯片，即骁龙（Snapdragon）8 Elite Gen 6与天玑（Dimensity）9600。然而，这两家手机芯片厂商接下来不仅需要向晶圆代工龙头台积电支付高昂的2nm代工费用，现在更必须应对LPDDR6 DRAM 价格的急剧上涨所带来的困境。市场消息指出，由于LPDDR6...

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技术代表着性能的提升，但其高昂的成本将使其在初期难以普及到非旗舰级设备。因此，包括晶圆代工与内存上涨的双重成本压力，预计将对高通和联发科的智能手机合作伙伴造成巨大负面影响。然而，市场也有传言称，中国内存制造商正在准备于2026年大规模生产LPDDR6 DRAM 技术。如果此消息属实，这或许能为高通的骁龙8 Elite Gen 6 和联发科联发科9600 在内存采购价格上提供一定的谈判筹码或定价优势。面对成本压力与市场需求的分化，高通预计将针对其下一代旗舰芯片采取差异化策略。高通据称将推出两个版本的骁龙8 Elite Gen 6，也就是标准版和顶级的骁龙8 Elite Gen 6 Pro。市场消息指出，这两个版本之间的主要差异在于：顶级的Pro 版本将配备更快的GPU，并支持更快的LPDDR6内存。三星最新曝光的LPDDR6内存采用的是12nm制程，传输速率为 10.7Gbps，I/O 通道数量进一步提升。而得益于动态电源管理系统，其能效提升了约 21%。在当前DRAM芯片价格持续上涨，明年一整年都难以缓解的背景下，无论是否采用最新的LPDDR6，内存成本无疑都会大幅上涨，这将会对2026年的旗舰设备造成不利影响。另一方面，高通和联发科的最新旗舰移动芯片还需要为台积电2nm晶圆代工支付约每片3万美元的高昂成本，因此定价或将进一步增长。值得注意的是，即使面临高昂的成本，高通和联发科仍在制程选择上寻求微小的性能优势。有传言指出，两家芯片制造商将利用台积电稍加改进的2nm（N2P）构架。尽管N2P 节点相较于标准的N2 制程仅提供了大约5%的性能提升，高通和联发科仍希望借此获得超越苹果（Apple）公司的优势。据悉，苹果将坚持为其A20 和A 20 Pro 芯片使用标准的2nm（N2）制程。不过，高通和联发科这种追求性能优势的举动，却可能导致骁龙8 Elite Gen 6 和天玑9600 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内存与2nm代工成本上涨 高通与联发科面临价格压力

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内存与2nm代工成本上涨高通与联发科面临价格压力