Tower半导体推出全新CPO晶圆代工技术

集成电路材料创...11-19

Tower半导体推出全新CPO晶圆代工技术据Tower Semiconductor官方获悉，近日，Tower宣布将其成熟且已投入量产的300mm晶圆键合技术平台进行战略性扩展。该技术最初为BIS传感器开发，现成功应用于公司先进的硅光子和锗硅BiCMOS工艺平台，实现异质三维集成电路集成，并获得Cadence设计工具对全系列堆叠平台技术的全面支持。据悉，Tower凭借多年在200mm与300mm...

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