光力科技：半导体封装设备应用于晶圆切割与减薄

证券之星2025-11-18

证券之星消息，光力科技(300480)11月17日在投资者关系平台上答复投资者关心的问题。

投资者提问：目前存储涨价，你们的设备是否可以在 HBM满足生产线？

光力科技回复：感谢您的关注！存储芯片与逻辑芯片、算力芯片等同样在封装工艺环节都需要使用划片机和研磨机。公司的半导体封装设备产品主要为半导体划切、研磨相关的高精密设备和耗材，主要应用于半导体后道封测领域中各类芯片的晶圆切割、封装体切割、晶圆减薄等工艺环节，客户主要为OSAT和IDM厂商，谢谢！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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