国金证券：先进封装+存储需求拉动半导体封装产业链量价齐升

智通财经11-19

智通财经APP获悉，国金证券发布研报称，先进封装+存储需求拉动下，看好半导体封装材料产业链将迎来量价齐升，环氧塑封料(EMC)随先进封装升级，高端产品单价可达基础型号10倍以上，国产化空间广阔;其关键填料硅微粉(如Low-α球铝)需求同步增长;载板上游的Low-CTE电子布和载体铜箔因供给紧缺、海外垄断，成为国产替代重点。国金证券主要观点如下：存储封装材料包括：①环氧塑封料，②硅微粉，③载板上游：...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2584799386?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-11-19 09:17","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2584799386","market":"hk","top_or_hot":-1,"title":"国金证券：先进封装+存储需求拉动半导体封装产业链量价齐升","media":"智通财经","content":"<div>\n<p>智通财经APP获悉，国金证券发布研报称，先进封装+存储需求拉动下，看好半导体封装材料产业链将迎来量价齐升，环氧塑封料(EMC)随先进封装升级，高端产品单价可达基础型号10倍以上，国产化空间广阔;其关键填料硅微粉(如Low-α球铝)需求同步增长;载板上游的Low-CTE电子布和载体铜箔因供给紧缺、海外垄断，成为国产替代重点。国金证券主要观点如下：存储封装材料包括：①环氧塑封料，②硅微粉，③载板上游：...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1370829.html\">网页链接</a>\n\n</div>\n","source":"stock_zhitongcaijing","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>国金证券：先进封装+存储需求拉动半导体封装产业链量价齐升</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n国金证券：先进封装+存储需求拉动半导体封装产业链量价齐升\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-11-19 09:17 北京时间&nbsp;&nbsp;&nbsp;<a href=http://www.zhitongcaijing.com/content/detail/1370829.html><strong>智通财经</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>智通财经APP获悉，国金证券发布研报称，先进封装+存储需求拉动下，看好半导体封装材料产业链将迎来量价齐升，环氧塑封料(EMC)随先进封装升级，高端产品单价可达基础型号10倍以上，国产化空间广阔;其关键填料硅微粉(如Low-α球铝)需求同步增长;载板上游的Low-CTE电子布和载体铜箔因供给紧缺、海外垄断，成为国产替代重点。国金证券主要观点如下：存储封装材料包括：①环氧塑封料，②硅微粉，③载板上游：...</p>\n\n<a href=\"http://www.zhitongcaijing.com/content/detail/1370829.html\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK0201","symbol_name":"可转债","start_time":0,"source_url":"http://www.zhitongcaijing.com/content/detail/1370829.html","article_id":"2584799386","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2584799386","pubTimestamp":1763515061,"columns":[],"sourceInfo":{"source_id":"stock_zhitongcaijing","name":"智通财经网"},"weMediaInfo":null,"summary":"智通财经APP获悉，国金证券发布研报称，先进封装+存储需求拉动下，看好半导体封装材料产业链将迎来量价齐升，环氧塑封料随先进封装升级，高端产品单价可达基础型号10倍以上，国产化空间广阔;其关键填料硅微粉需求同步增长;载板上游的Low-CTE电子布和载体铜箔因供给紧缺、海外垄断，成为国产替代重点。","collect":0,"end_time":0,"defaultTopTitle":"zhitongcaijing.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159582":"半导体","600109":"国金证券","BK0201":"可转债","BK4588":"碎股","SOXX":"iShares费城交易所半导体ETF","SOXL":"三倍做多半导体ETF-Direxion Daily","BK0012":"证金概念","SMH":"半导体指数ETF-HOLDRs","BK4585":"ETF&股票定投概念","BK0028":"国家队","BK0276":"资本市场","BK0183":"MSCI概念","BK0188":"融资融券"},"translate_title":"Sinolink Securities: Advanced packaging + storage demand drives both volume and price of semiconductor packaging industry chain to rise","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159582":1.5,"600109":1.5,"SOXX":0.6,"SOXL":1.5,"SMH":0.6},"content_text":"智通财经APP获悉，国金证券发布研报称，先进封装+存储需求拉动下，看好半导体封装材料产业链将迎来量价齐升，环氧塑封料(EMC)随先进封装升级，高端产品单价可达基础型号10倍以上，国产化空间广阔;其关键填料硅微粉(如Low-α球铝)需求同步增长;载板上游的Low-CTE电子布和载体铜箔因供给紧缺、海外垄断，成为国产替代重点。国金证券主要观点如下：存储封装材料包括：①环氧塑封料，②硅微粉，③载板上游：Low-CTE电子布/载体铜箔。环氧塑封料：国产化率低，期待产品结构迭代、单位价值量跃升环氧塑封料(EMC)属于半导体封装材料里的包封材料，随着先进IC封装技术的不断发展，对EMC材料的综合性能提出越来越高的要求。国产化率低、估计高性能EMC国产化率仅10-20%，先进封装国产化率更低，海外主要竞争对手包括住友电木、力森诺科等，国内企业有望重塑EMC行业竞争格局。随着国内封测向先进封装迭代，环氧塑封料存在产品结构迭代、单位价值量跃升的逻辑，例如应用于先进封装FOWLP/FOPLP的环氧塑封料需以颗粒状(GMC)的形态呈现，对环氧塑封料的性能提出更高要求。参考衡所华威数据，先进封装EMC单价是高性能EMC的5-6倍、是基础EMC价格的10倍以上。以存储为例，随着SK海力士从DRAM向HBM迭代，其HBM采用MR-MUF技术、在半导体芯片缝隙中注入液体EMC。硅微粉：环氧塑封料关键原材料环氧塑封料主要原材料为硅微粉、环氧树脂、酚醛树脂、添加等，其他辅料材料包括包材、备件等，其中无机填料起到有效降低环氧塑封料热膨胀系数的作用。参考华海诚科收购标的衡所华威数据，2023-2024年其第一大供应商均为联瑞新材(采购硅微粉及添加剂)，2024年硅微粉、添加剂分别占衡所华威原材料采购金额的比重为29%、26%。Low-α球铝可以很好解决在存储领域高密度叠层封装所遇到的问题，联瑞新材Low-α球铝系列产品放射性元素铀(U)和钍(Th)含量均低于5ppb级别，最低可低于1ppb级别，已稳定批量配套行业领先客户。载板上游：Low-CTE电子布/载体铜箔封装基板与PCB制造原理相近，具有高密度、高精度、高性能、小型化及薄型化等特点，是芯片封装不可或缺的一部分，为主要应用于移动智能终端、服务器/存储等领域。(1)Low-CTE电子布：终端主要应用场景包括存储、FC-BGA、5G高频通信等领域，目前已成为载板环节重要供给瓶颈。根据中国台湾工商时报消息，日商三菱化学发出通知，因Low-CTE玻纤布原料短缺、以及订单需求增加，导致其BT载板材料交期大幅拉长，部分Low-CTE玻纤布交期达16-20周。(2)载体铜箔：主要应用于IC载板、类载板，当前带载体可剥离超薄铜箔的全球市场规模约50亿元，多年来基本被日本三井金属垄断。随着AI技术发展，对先进芯片需求(例如SLP)不断增加，将推动载体铜箔市场持续增长，日本企业扩产节奏及意愿偏弱，叠加国内供应链加速本地化，利于载体铜箔国产替代进程。风险提示国产替代不及预期;进入海外供应链节奏不及预期;行业竞争格局恶化。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.35.9","shortVersion":"4.35.9","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2584799386","isCrawlerRequest":true}