台积电不再是唯一：苹果、高通评估Intel先进封装替代

快科技11-17

快科技11月17日消息，随着全球对AI和高性能计算芯片需求的增长，先进封装技术的需求持续升温，市场对台积电CoWoS产线的依赖也达到了高峰。由于台积电的CoWoS产能目前主要被NVIDIA、AMD以及大型云端客户承包，留给新客户的排程弹性和空间非常有限。这使得其他芯片大厂不得不开始积极评估并布局多元化的封装路线，包括苹果和高通在内的多家科技巨头，正积极在其新招聘的职缺中明确要求具备Intel ...

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