CoWoS 产能大幅上调！

印科技2025-11-17

台积电AP8 厂提前爬坡以及来自英伟达与ASIC客户的需求激增，JPM指出台积电再次加速扩充CoWoS产能，目前预计2026 年底每月产能将达到10.5万片（此前预估为9.5万片）。预计2027年产能预计将进一步提高至每月14.1万片。此外，台积电之外的CoWoS产能将自2026年下半年开始贡献，分别占2026/2027年总产能的9%/11%。在强劲需求带动下，台积电2026年CoWoS产出预计...

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v6p/v7p项目推进、Anthropic大额订单、Tomahawk 6迁移至 CoWoS-S等因素驱动。此外，联发科的TPU在2027年需求预计高达4万片。AWS的Trainium 3需求稳定，预计2026年需求约8万片。为平衡产能和调配资源，台积电也在加速后段外包。JPM指出，自2026年起约70%的CoWoS-L后段制程将外包给日月光（ASE）与硅品（SPIL）。而且台积电也正在加速将探针测试外包给 Ardentec、日月光与京元电。自2027年起，部分AI加速器项目将在更多环节外包给OSAT。先进封装多路并进在强劲需求带动下，台积电持续提升先进封装技术和扩充产能。在CoWoS持续扩产以及将于2026年推出的升级版InFO-PoP“WMCM”之后，台积电进一步将CoWoS 与扇出型面板封装（FOPLP）技术整合，形成全新的CoPoS。同时，台积电正悄然加速CoPoS（玻璃载板，310×310mm）的量产进程，台积电已向半导体供应链伙伴透露，将于2026年在世大建立首条CoPoS试产线，并将在嘉义AP7厂作为未来量产基地。此外，美国亚利桑那州的先进封装厂也计划采用CoPoS技术。自2029年起，CoPoS量产出货将逐步成为主流。本质上，CoPoS 是“面板化的 CoWoS”，将芯片排布在方形面板而非圆形晶圆上，从而显著提高产能效率。台积电的CoWoP则定位低成本非前沿方案，CoWoP因技术难度高，未来更可能作为成本更低、但非领先制程的方案。随着2nm ASIC将于2027–28年进入广泛采用期，在SoIC方面产能台积电也在提前布局，SoIC产能预计在2026/27年达到2.2万/3万片。而WMCM（晶圆级多芯片封装）将从iPhone A20 Pro开始采用，2026 年首次应用于 iPhone A20 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