AI计算是真实存在！“黑马争夺战”启幕→HBM、晶圆代工与机器人谁能领跑未来？

市场资讯11-12

（来源：长江镍业网）2026科技产业竞速赛：HBM、晶圆代工与机器人谁能领跑未来？当英伟达CEO黄仁勋断言“AI与互联网泡沫有本质区别”时，他不仅为AI计算需求的真实性正名，更揭示了一个核心逻辑：科技产业的进化已从概念炒作转向硬核技术驱动。2026年，随着HBM存储架构突破、晶圆代工进入2nm多维竞争时代、人形机器人量产爆发，一场关于技术深度、产业协同与场景落地的“黑马争夺战”正在拉开帷幕。HBM...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2582317024?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-11-12 10:00","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2582317024","market":"us","top_or_hot":-1,"title":"AI计算是真实存在！“黑马争夺战”启幕→HBM、晶圆代工与机器人谁能领跑未来？","media":"市场资讯","content":"<div>\n<p>（来源：长江镍业网）2026科技产业竞速赛：HBM、晶圆代工与机器人谁能领跑未来？当英伟达CEO黄仁勋断言“AI与互联网泡沫有本质区别”时，他不仅为AI计算需求的真实性正名，更揭示了一个核心逻辑：科技产业的进化已从概念炒作转向硬核技术驱动。2026年，随着HBM存储架构突破、晶圆代工进入2nm多维竞争时代、人形机器人量产爆发，一场关于技术深度、产业协同与场景落地的“黑马争夺战”正在拉开帷幕。HBM...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202511121023409763b1b1&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AI计算是真实存在！“黑马争夺战”启幕→HBM、晶圆代工与机器人谁能领跑未来？</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAI计算是真实存在！“黑马争夺战”启幕→HBM、晶圆代工与机器人谁能领跑未来？\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-11-12 10:00 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202511121023409763b1b1&s=b><strong>市场资讯</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>（来源：长江镍业网）2026科技产业竞速赛：HBM、晶圆代工与机器人谁能领跑未来？当英伟达CEO黄仁勋断言“AI与互联网泡沫有本质区别”时，他不仅为AI计算需求的真实性正名，更揭示了一个核心逻辑：科技产业的进化已从概念炒作转向硬核技术驱动。2026年，随着HBM存储架构突破、晶圆代工进入2nm多维竞争时代、人形机器人量产爆发，一场关于技术深度、产业协同与场景落地的“黑马争夺战”正在拉开帷幕。HBM...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202511121023409763b1b1&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1037948541.HKD","symbol_name":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202511121023409763b1b1&s=b","article_id":"2582317024","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202511121023409763b1b1&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2582317024","pubTimestamp":1762912800,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"2026科技产业竞速赛：HBM、晶圆代工与机器人谁能领跑未来？2026年，随着HBM存储架构突破、晶圆代工进入2nm多维竞争时代、人形机器人量产爆发，一场关于技术深度、产业协同与场景落地的“黑马争夺战”正在拉开帷幕。当HBM、晶圆代工与机器人同时按下加速键，我们正站在一个新时代的门槛上。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","03145":"华夏亚洲高息股","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","BK4141":"半导体产品","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","BK4585":"ETF&股票定投概念","HBM":"HudBay Minerals Inc","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC","LU1868837722.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"2\" (USD) ACC","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","BK4602":"量子计算概念","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","LU0689626769.HKD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (HKD) ACC","BK4505":"高瓴资本持仓","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","BK4612":"AI芯片","TSLA":"特斯拉","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","AI":"C3.ai, Inc.","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","TSM":"台积电","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","BK4532":"文艺复兴科技持仓","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","LU0158827948.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"A\" (USD) INC","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","NVDA":"英伟达","LU2089283258.USD":"安联环球可持续基金Cl AM Dis"},"translate_title":"AI computing is real! The \"dark horse battle\" begins → Who can lead the future, HBM, wafer foundry or robots?","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDA":0.9,"TSLA":0.9,"HBM":0.9,"03145":0.6,"AI":0.9,"TSM":0.9},"content_text":"（来源：长江镍业网）2026科技产业竞速赛：HBM、晶圆代工与机器人谁能领跑未来？当英伟达CEO黄仁勋断言“AI与互联网泡沫有本质区别”时，他不仅为AI计算需求的真实性正名，更揭示了一个核心逻辑：科技产业的进化已从概念炒作转向硬核技术驱动。2026年，随着HBM存储架构突破、晶圆代工进入2nm多维竞争时代、人形机器人量产爆发，一场关于技术深度、产业协同与场景落地的“黑马争夺战”正在拉开帷幕。HBM：AI算力的“血管”革命AI运算对存储器带宽的渴求已成行业痛点。当前，HBM（高带宽内存）通过3D堆叠技术将内存与GPU直接绑定，使数据传输速率较传统DDR提升数十倍。但面对千亿参数模型的推理需求，HBM3E仍显吃力。次世代突破口或在于两大方向：•材料创新：过渡至HBM4时代，采用更先进的1β制程与低介电常数材料，将单堆栈容量从24GB推向32GB以上；•架构重构：通过“芯片-内存-互连”一体化设计（如AMD的CDNA4架构），将存储器直接嵌入计算单元，实现“零延迟”数据流动。TrendForce预测，2026年HBM市场规模将突破200亿美元，而率先实现“每瓦带宽”突破的企业，将主导AI服务器内存标准制定权。晶圆代工：2nm时代的“系统级战争”当TSMC、Intel、Samsung在2nm制程上短兵相接，单纯的晶体管密度竞赛已演变为封装、材料、EDA工具的全链条博弈：•TSMC的CoWoS-L通过局部硅互连（LSI）技术，将多芯片模块的带宽密度提升3倍，支撑AI芯片“乐高式”组合；•Intel的EMIB 2.0以嵌入式桥接芯片替代传统硅转接板，使异构集成成本降低40%；•Samsung的I-Cube4通过3D堆叠将HBM与逻辑芯片垂直整合，解决AI加速器“内存墙”问题。这场战争的胜负手，不仅在于制程节点，更在于能否构建从设计到封装的“生态闭环”。2026年，晶圆代工厂的竞争将升级为“技术代差+客户绑定能力”的双维度较量。人形机器人：从实验室到“iPhone时刻”黄仁勋曾预言“AI的终极形态是物理世界交互”，而人形机器人正是这一预言的具象化。2026年，随着特斯拉Optimus、Figure 02等机型量产，全球出货量或突破50万台，成为智能制造与家庭服务的“新基建”。其颠覆性在于：•技术融合：结合多模态大模型（如GPT-4o）、力控关节与SLAM导航，实现从“指令执行”到“自主决策”的跨越；•场景渗透：在3C装配、仓储物流等工业场景替代30%重复劳动，在养老、教育等民生领域创造万亿级服务市场；•成本下探：通过规模化生产与国产零部件替代（如绿的谐波谐波减速器），将单价从10万美元压至2万美元以内。这场变革的深度，或将超越智能手机对功能机的替代——它重新定义了“劳动力”的边界。未来图景：技术共生与产业重构HBM、晶圆代工与机器人的崛起，并非孤立事件，而是AI技术链的“三重奏”：• HBM为AI提供“血液”，晶圆代工铸造“大脑”，机器人则赋予AI“四肢”；•三者共同推动科技产业从“数字世界”向“物理世界”渗透，催生智能制造、自动驾驶、空间计算等新业态；•而黄仁勋所强调的“真实计算需求”，正是这场变革的底层逻辑——技术必须解决实际问题，才能避免泡沫化。2025年11月27日，TrendForce集邦咨询“2026十大科技市场趋势预测发布暨TechFuture Awards颁奖典礼”将在深圳揭晓答案。这场盛会不仅会解析HBM带宽突破路径、晶圆代工生态战局与人形机器人量产时间表，更将挖掘那些尚未被市场充分认知的“隐形机遇”——或许，下一个科技黑马正藏在某个实验室的原型机中，等待2026年的爆发。科技产业的魅力，在于它永远比想象中更快一步。当HBM、晶圆代工与机器人同时按下加速键，我们正站在一个新时代的门槛上。免责声明：本文内容仅对市场进行分析，不构成投资建议。市场有风险，决策需谨慎","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"deviceId":"web-server-community-laohu8-v3","version":"4.35.10","shortVersion":"4.35.10","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2582317024","isCrawlerRequest":true}