帝尔激光：TGV激光微孔设备已出货

证券之星11-07

证券之星消息，帝尔激光(300776)11月07日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘你好，英伟达和英特尔等海外巨头即将放量的tgv玻璃基板技术，据说公司拿到的海外订单是英特尔和英伟达，传公司即将给东山精密和胜宏科技等龙头送样测试了，请问tgv设备能做到多少毛利？谢谢

帝尔激光回复：您好！感谢您的关注！公司的TGV激光微孔设备，目前已经完成面板级玻璃基板通孔设备的出货，实现了晶圆级和面板级TGV封装激光技术的全面覆盖。公司PCB业务主要方向为超快激光钻孔技术的开发，已与2到3家客户进行对接，目前，超快激光钻孔设备样机正在试制中。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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