美畅股份：已成功研发半导体材料切割专用金刚线

证券之星10-22

证券之星消息，美畅股份(300861)10月22日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司产品有没有应用到半导体领域的切割？

美畅股份回复：尊敬的投资者，您好！公司针对半导体材料的切割需求，已成功研发了专用的金刚线。该系列产品在多年前已推向市场，目前产量稳定，工艺成熟，能够满足客户精密加工的需求。感谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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