阿里巴巴公开集成电路和芯片封装专利

人民财讯2025-09-24

企查查APP显示，近日，阿里巴巴(中国)有限公司“集成电路组件和芯片封装结构”专利公布。　　企查查专利摘要显示，所述集成电路组件包括：第一晶圆裸片，形成有多个运算单元，所述多个运算单元用于并行地执行逻辑运算；第二晶圆裸片，与所述第一晶圆裸片叠置，所述第二晶圆裸片中形成有多个访问控制单元；其中，每个运算单元对应于所述多个访问控制单元，每个运算单元向至少一个访问控制单元分别发送至少一个数据访问指令，使...

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