思泰克：核心产品应用于半导体后道封装工艺检测

证券之星09-22

证券之星消息，思泰克(301568)09月22日在投资者关系平台上答复投资者关心的问题。

投资者提问：您好，请问贵司的检测设备是否涉及到半导体业务？比如HBM检测等。或者有无拓展计划。

思泰克回复：尊敬的投资者，您好！公司核心产品能够应用于半导体后道封装工艺检测。感谢您的关注。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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