【产业信息速递】HBM，另一场混战

北京半导体行业...09-15

（信息来源：chosun）SEMECS、韩华半导体和韩美半导体三家公司在高带宽存储器（HBM）核心半导体设备TC键合机（TC Bonder）的竞争中处于白热化阶段，目前正加速混合键合机的量产准备工作，预计该设备将从第六代HBM（HBM4）生产开始部分采用。三星电子和SK海力士已进行HBM4的量产测试，目前的关键在于设备价格（比现有TC键合机高出两倍以上）以及与美国和荷兰制造的设备相比，能否确保技术...

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Bonder）的竞争中处于白热化阶段，目前正加速混合键合机的量产准备工作，预计该设备将从第六代HBM（HBM4）生产开始部分采用。三星电子和SK海力士已进行HBM4的量产测试，目前的关键在于设备价格（比现有TC键合机高出两倍以上）以及与美国和荷兰制造的设备相比，能否确保技术...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250915152931952e619c&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2089283258.USD","symbol_name":"安联环球可持续基金Cl AM Dis","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250915152931952e619c&s=b","article_id":"2567194472","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250915152931952e619c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, 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2025”上公布了包括混合键合机蓝图在内的下一代先进半导体封装设备开发路线图。今年，韩华半导体在半导体封装设备市场取得了一系列成就。其中一个代表性的例子是，今年赢得了SK海力士的订单，为其提供价值约805亿韩元的TC键合机设备。韩华半导体设备业务部部长朴永民表示，“韩华半导体于2022年成功向客户交付了第一代混合键合机设备”，并补充道，“我们正在做好准备，以便目前正在开发的第二代设备能够在明年第一季度接受客户评估。”韩美半导体也在大力投资混合键合机领域。该公司正在仁川西区朱安国家工业园区建设一座占地约14,600平方米（4,415坪）的“混合键合机工厂”，耗资约1000亿韩元。该工厂预计将于明年下半年竣工。该工厂将生产用于HBM和逻辑半导体（XPU）的混合键合机、下一代HBM TC键合机、无助焊剂键合机以及用于AI 2.5D封装的大芯片TC键合机。不过，主流观点认为，美国最大的半导体设备制造商应用材料公司（AMAT）与荷兰Besi公司联合开发的混合键合机的技术稳定性优于韩国国内公司。两家公司联合开发的设备自去年以来已交付给三星电子和美光公司进行测试，目前仍被视为优先供应商（vendor）。问题在于设备价格。一位半导体行业人士表示：“从技术角度来看，Applied 和 Besi 是最稳定的选择，而从存储器半导体公司的角度来看，最优先的合作伙伴也是与他们合作已久的 Applied 和 Besi。”但他补充道：“然而，设备价格远远超过现有键合机的两倍。三星电子和 SK 海力士的目标是通过国内设备公司建立多供应商体系，以降低采购价格。”据市场研究公司 Verified Market Research 称，全球混合键合机市场规模预计将从 2023 年的约 7 万亿韩元增长到2033 年的 20 万亿韩元。原因在于，随着 HBM 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