方邦股份：预计未来可剥铜订单有望逐步放量

格隆汇09-10

在2025年半年度业绩会上，方邦股份董事长、总经理苏陟在回复可剥铜业务进展时介绍，公司可剥铜通过了多个代表性线路板厂商的认证，由于可剥铜技术壁垒高，IC载板制备工艺复杂，使用可剥铜制备的载板直接与芯片连接，对芯片性能的发挥起着重要作用，因此下游客户及终端对于使用国产可剥铜材料非常谨慎。目前公司可剥铜已通过了部分代表性线路板厂商的认证，持续获得小批量订单，预计随着时间推移，可剥铜订单有望逐步放量。

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