【产业信息速递】三星封装，重大突破

北京半导体行业...08-25

（信息来源：biz.chosun）三星电机正加快向快速成长的人工智能（AI）定制芯片（ASIC）市场供应倒装芯片（FC）-球栅阵列（BGA）的步伐。据悉，三星电机已从向亚马逊供应AI半导体“Trainium”用FC-BGA开始，计划从明年起正式向苹果、谷歌和Meta供应FC-BGA。在其负责基板业务的封装解决方案事业部盈利恶化的背景下，公司正收紧对高附加值基板供应的控制。根据三星电机22日发布的...

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