天岳先进与东芝电子元件达成合作协议

格隆汇08-22

东芝电子元件与天岳先进就天岳先进开发制造的SiC功率半导体用衬底达成基本协议，双方将开展以下合作：针对SiC功率半导体特性提升与品质改善的技术协作，以及运用合作成果扩大高品质稳定衬底供应的商业合作。

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