三星电子重返苹果供应链，获iPhone图像传感器订单

爱集微2025-08-10

三星电子近日宣布，将时隔近十年再次向苹果公司供应下一代先进半导体芯片，标志着其在半导体领域的全面反弹。此次合作涉及智能手机图像传感器的供应，该领域此前由索尼独家供应。当地时间8月6日，苹果公司公布了其在美国的投资计划，其中包括与三星电子的新合作。苹果在新闻稿中表示，双方将合作开发创新的新型芯片制造技术，该技术将在三星位于奥斯汀的半导体工厂首次全球应用。尽管苹果尚未透露具体开发细节，但据报道称，...

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18，该款手机预计最早于明年发布。此次合作是继2015年三星为iPhone供应A9应用处理器后，时隔十年的重要回归。三星电子与苹果的合作重点在于推进用于下一代芯片开发的三层晶圆直接堆叠技术，旨在缩小图像传感器的像素尺寸并减少干扰现象。这一技术突破有望撼动索尼在全球图像传感器市场的主导地位。目前，索尼占据该市场45%的份额，而三星电子为19%。半导体工程协会前会长李圭福表示，苹果此次选择三星电子，表明其技术进步显著。一旦合作取得突破，三星电机相机模块等其他产品与苹果的一揽子交易可能性将大增。此前，三星晶圆代工业务部门因缺乏大客户而陷入亏损。然而，凭借此次苹果订单及上月获得的特斯拉2纳米工艺芯片生产合同（价值约23万亿韩元，期限至2033年），三星电子有望实现显著增长。特斯拉委托生产的AI6芯片将用于下一代自动驾驶和机器人。获得苹果等大型科技公司的订单对三星电子至关重要，这不仅有助于吸引其他大客户，还能推动其晶圆代工业务的整体发展。业内人士分析，三星电子通过提供低利润率订单和定制资源，正逐步赢得大型科技公司的青睐。据报道，三星电子目前正与高通、NVIDIA等公司就代工采购合同进行初步测试，特别是与高通合作开发下一代先进移动应用处理器。高通曾是三星电子的主要客户，后转向台积电。此次三星电子与苹果的合作，不仅是对其技术实力的认可，也为其在全球半导体市场的进一步扩张奠定了坚实基础。随着更多大型科技客户的加入，三星电子有望在晶圆代工领域迎来新的增长高峰。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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