突破晶圆限制：消息称三星研发 415mm×510mm 面板级先进封装 SoP

IT之家2025-08-12

IT之家 8 月 12 日消息，随着单体芯片大小触及光罩尺寸限制，现代超高性能芯片越来越依赖先进封装实现多个功能裸晶的聚合。而对于超大规模芯片系统而言，300mm 直径的 12 英寸晶圆 (Wafer) 也终将无法满足大规模高效率量产的需求，以更大面积的面板 (Panel) 作为“舞台”的下一代先进封装正在蓬勃发展。韩媒 ZDNet Korea 当地时间今日报道称，为与英特尔、台积电争夺超大规模...

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