格罗方德与中国本土晶圆厂达成合作，率先推出汽车级CMOS和BCD技术

爱集微08-06

尽管由于消费需求低迷，第三季度前景黯淡，但格罗方德仍在中国市场大胆布局。格罗方德正与一家中国本土代工厂达成新协议，加速其“中国制造”战略，并将率先推出汽车级CMOS和BCD技术。格罗方德公司高管称，目标订单来自在中国有需求的国内外半导体公司，客户在转移晶圆厂时无需重新开发或重新认证芯片设计。格罗方德强调将保留对知识产权（IP）和质量的完全控制权，同时充分利用在中国的强大客户关系——过去一年，该公司...

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Breen指出，此举也引发了中国客户的强烈兴趣，他们寻求的不仅仅是国内供应。他补充道，许多客户现在正在推行双源模式——在中国本土生产，同时利用格罗方德的全球影响力服务海外市场。格罗方德并非唯一一家押注中国本土化的公司。据报道，恩智浦也在考虑与当地晶圆代工厂合作，实现芯片完全在中国生产。尽管恩智浦已在天津运营着一家大型封装测试工厂，但晶圆制造业务仍然集中在其美国和新加坡工厂。格罗方德对第三季度的业绩预期较为悲观，预计营收为16.8亿美元，远低于华尔街17.9亿美元的预期，原因是消费电子产品需求依然低迷。格罗方德在6月将其投资计划提高至160亿美元，其中新增10亿美元资本支出，30亿美元用于下一代电动汽车和人工智能（AI）服务器芯片的研发。得益于成本削减以及汽车和数据中心领域的稳健增长，格罗方德第二季度营收达到16.9亿美元，每股收益达到42美分，超出预期。（校对/赵月）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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